ATS-18E-34-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-18E-34-C3-R0-ND

Manufacturer Part#:

ATS-18E-34-C3-R0

Price: $ 5.95
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 57.9X36.83X22.86MM T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-18E-34-C3-R0 datasheetATS-18E-34-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 5.35563
30 +: $ 5.05785
50 +: $ 4.76041
100 +: $ 4.46286
250 +: $ 4.16534
500 +: $ 3.86781
1000 +: $ 3.79343
Stock 1000Can Ship Immediately
$ 5.95
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 2.280" (57.90mm)
Width: 1.450" (36.83mm)
Diameter: --
Height Off Base (Height of Fin): 0.900" (22.86mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 14.40°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-18E-34-C3-R0 is a type of thermal-heat sink, which is used for cooling and transferring heat away from electronic circuits. A thermal-heat sink typically consists of an array of heat-conducting material, such as copper, and a heat-dissipating material, such as aluminum, that work together to move heat away from the electronic circuits. The ATS-18E-34-C3-R0 is a high-performance thermal-heat sink that can be used in a variety of applications.

The ATS-18E-34-C3-R0 thermal-heat sink can be used in a variety of applications, including electronic components, power supplies, lasers, LEDs, and medical equipment. It is designed to provide excellent heat transfer efficiency, as well as thermal stability, thus preventing the damage of components due to thermal overload. The ATS-18E-34-C3-R0 thermal-heat sink is suitable for applications where extreme performance and reliability are required. It also is designed to provide superior thermal performance in applications that require higher temperatures.

The ATS-18E-34-C3-R0 thermal-heat sink is made from a combination of aluminum and copper, which are two of the best materials for heat speaking and dissipating. The aluminum base material has a low resistance to heat. Aluminum is also lightweight, which makes it easier to mount and install in the desired location. Copper is an excellent heat conductor, and its combination with aluminum provides superior performance in cooling electronic components. The aluminum material also provides an effective thermal barrier, which enables the heat to dissipate into the surrounding environment instead of accumulating in the component.

The ATS-18E-34-C3-R0 thermal-heat sink works by absorbing the heat generated by the electronic components and transferring it into a heat sink. A heat sink is a metal plate or container filled with liquid or gas-filled material that can absorb and dissipate heat. The ATS-18E-34-C3-R0 thermal-heat sink is designed to provide highly efficient thermal transfer, ensuring that the components remain cool even when subjected to high temperatures.

The ATS-18E-34-C3-R0 thermal-heat sink is easy to install and mount, as it is designed to mount directly onto any surface. The thermal-heat sink can be used in a variety of applications, including computers, servers, laboratories, automotive equipment, and other applications that require exceptional cooling performance.

The ATS-18E-34-C3-R0 thermal-heat sink is designed to provide high thermal performance in applications that require high-performance cooling. It is an effective solution to many high-temperature cooling requirements. The ATS-18E-34-C3-R0 is an excellent choice for applications that require high-efficiency thermal transfer and cooling performance. It is easy to install, efficient, and reliable, making it an ideal choice for many industrial and commercial cooling applications.

The specific data is subject to PDF, and the above content is for reference

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