| Allicdata Part #: | ATS-18E-35-C2-R0-ND |
| Manufacturer Part#: |
ATS-18E-35-C2-R0 |
| Price: | $ 5.68 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X5.84MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18E-35-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.11245 |
| 30 +: | $ 4.82853 |
| 50 +: | $ 4.54444 |
| 100 +: | $ 4.26044 |
| 250 +: | $ 3.97641 |
| 500 +: | $ 3.69238 |
| 1000 +: | $ 3.62137 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.230" (5.84mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 22.48°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are essential in many electronic systems, providing a vital path for heat to dissipate away from components. ATS-18E-35-C2-R0 is a thermal-heat sink designed to provide the most effective thermal performance for power supply components. Its unique design combines thermal conductivity and thermal capacity to create a superior thermal solution.
The thermal design of ATS-18E-35-C2-R0 utilizes a combination of conduction and convection to achieve the best thermal performance available. It features a unique heat conducting plate, made from anodized aluminum, which is designed to optimize air-flow and increase heat dissipation. Additionally, the plate features an open channel-matrix that disperses and dissipates heat away from the components. The heat conducting plate is surrounded by a series of thermal fins, which provide fine control of air flow and further enhance the thermal performance of the sink.
The thermal capacity of ATS-18E-35-C2-R0 is further increased by the use of a proprietary thermal interface material. This material bonds the heat conducting plate to the component, ensuring a secure, optimal thermal connection. Additionally, the material also increases the effective surface area of the plate for increased heat dissipation.
In terms of applications, ATS-18E-35-C2-R0 is well-suited for power supply components that need effective thermal management. It is also well-suited for applications with limited air-flow, as it can take advantage of its own open channel-matrix to dissipate heat away from the component. Additionally, the thermal interface material ensures that the heat can be transferred away from the component quickly and efficiently.
Overall, ATS-18E-35-C2-R0 is an excellent thermal solution for power supply components. Its combination of conduction and convection provides excellent thermal performance, while its thermal interface material further increases its thermal capacity. As such, it is an ideal choice for applications that require effective heat management.
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