| Allicdata Part #: | ATS-18E-51-C3-R0-ND |
| Manufacturer Part#: |
ATS-18E-51-C3-R0 |
| Price: | $ 3.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18E-51-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.31695 |
| 30 +: | $ 3.22707 |
| 50 +: | $ 3.04781 |
| 100 +: | $ 2.86858 |
| 250 +: | $ 2.68930 |
| 500 +: | $ 2.59965 |
| 1000 +: | $ 2.33071 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.22°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices used to dissipate heat from electrical components, which ultimately increases the life of the component and preserves performance. The thermal characteristics of a heat sink depends on its size, the surface geometry, its thermal conductivity, the amount of convectional currents within the air, and the amount of external cooling (e.g. a fan) it has.
ATS-18E-51-C3-R0 is a thermal heat sink created to maximize heat dissipation in high-power electrical applications, such as power supplies, servers, amplifiers, and other power-intensive machinery. The device is composed of aluminum fins soldered onto a copper base. The aluminum fins are strategically placed to maximize the surface area in air, with each fin having a wall thickness of 0.35mm. The fin width is 0.7mm and the number is 30. The fins are also soldered to the plate for better contact and heat transfer.
When it comes to its working principle, the ATS-18E-51-C3-R0 has a simple concept. Heat from the component is transferred to the heat sink, where most of the heat is dissipated into the atmosphere. This heat dissipation is achieved through a simple process; when an electrical component is switched on, it produces a large amount of heat, which is transferred to the heat sink. In response, the heat sink begins to cool down, dissipating the heat to the environment. The fins are integral to the process; they act as mediums for transferring the heat from the component to the atmosphere. The fins also provide a large surface area for air to pass through, which aids in heat dissipation and also helps the heat sink to remain cooler for longer.
To ensure that the heat sink works effectively, it is important to consider its size and its environment. The larger the heat sink, the more effective it will be, as more space is provided for heat to be dissipated. It is also important to consider the environment it is in, as air circulation can help provide additional cooling, though this can also pose a risk of dust and dirt entering the fins, which can block heat dissipation.
Overall, the ATS-18E-51-C3-R0 thermal heat sink is a valuable device, designed to maintain high levels of thermal conductivity and to preserve performance and longevity. It is able to effectively dissipate heat from electrical components in a short amount of time, providing a long-lasting and reliable solution for high-power applications.
The specific data is subject to PDF, and the above content is for reference