| Allicdata Part #: | ATS-18E-54-C1-R0-ND |
| Manufacturer Part#: |
ATS-18E-54-C1-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18E-54-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.23358 |
| 50 +: | $ 3.04340 |
| 100 +: | $ 2.85314 |
| 250 +: | $ 2.66293 |
| 500 +: | $ 2.47272 |
| 1000 +: | $ 2.42517 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.96°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks
In order to address a variety of thermal management challenges, a heat sink is often used to dissipate heat away from the sensitive components of an electronic circuit. Heat sinks are critical for the proper operation of high-end consumer devices such as laptops, TVs, and gaming consoles, as well as for industrial and medical equipment. The ATS-18E-54-C1-R0 heat sink is a unique design designed to meet the needs of a wide range of applications, with excellent thermal performance.
The ATS-18E-54-C1-R0 heat sink is a two-stage extra-low profile heat sink specifically designed for cooling components in compact electronic assemblies. The first stage of the device is a folded heat sink, with air passing over its finned surfaces to cool the components. The second stage is a finned heat pipe that transfers the heat to a larger heat sink, allowing for greater overall heat dissipation. This unique design gives the ATS-18E-54-C1-R0 heat sink a number of advantages over other types of thermal management solutions.
For example, the ATS-18E-54-C1-R0 heat sink is designed to be as compact as possible, while still providing superior cooling performance. This means that the device can be used in the most challenging environments, such as in embedded and portable devices. Furthermore, the ATS-18E-54-C1-R0 heat sink can be used in a variety of applications, from LED lighting to automotive applications, due to its low profile and high-performance design.
The ATS-18E-54-C1-R0 heat sink is designed to work in three different ways. First, it is designed to dissipate heat through its finned heat sink. This finned design helps to increase the surface area and provide improved convection heat transfer performance. Second, the device works as an active heat pipe to transfer the heat away from the sensitive components. The finned heat pipe helps to increase the heat transfer efficiency, while also helping to reduce air turbulence in the cooling fan.
Finally, the finned heat pipe is designed to be more efficient than traditional heat pipe designs. This improved efficiency helps to reduce the noise level associated with standard heat pipe designs, as well as reducing the overall power consumption. As a result, the ATS-18E-54-C1-R0 heat sink provides superior thermal performance in a variety of applications.
Overall, the ATS-18E-54-C1-R0 heat sink is an excellent choice for a wide range of applications. The device’s compact size, high-performance design, and improved efficiency make it an ideal solution for many types of thermal management challenges. Furthermore, the design of the ATS-18E-54-C1-R0 heat sink ensures that it will remain reliable and effective for many years to come.
The specific data is subject to PDF, and the above content is for reference