Allicdata Part #: | ATS-18F-10-C1-R0-ND |
Manufacturer Part#: |
ATS-18F-10-C1-R0 |
Price: | $ 3.61 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 45X45X25MM XCUT |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ATS-18F-10-C1-R0 Datasheet/PDF |
Quantity: | 1000 |
10 +: | $ 3.28104 |
30 +: | $ 3.19242 |
50 +: | $ 3.01505 |
100 +: | $ 2.83771 |
250 +: | $ 2.66036 |
500 +: | $ 2.57169 |
1000 +: | $ 2.30565 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.772" (45.00mm) |
Width: | 1.772" (45.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-18F-10-C1-R0 thermal - heat sink is a thermoelectric cooling device used for the stabilization and cooling of electronic components. It is designed to transfer heat away from a heat-generating source, such as a computer, television, or any other device that needs to be kept cool.
The ATS-18F-10-C1-R0 is a combination of a heat sink and thermoelectric cooling module (TEC). The heat sink is used to disperse heat away from the thermoelectric chip and into the air, while the thermoelectric chip is used to convert the heat into electrical energy. The ATS-18F-10-C1-R0 is designed to dissipate up to 10 watts of heat, making it capable of cooling larger devices.
The ATS-18F-10-C1-R0 heat sink has a black anodized finish and includes four swivel clips that enable easy installation in tight spaces. It comes with two hole patterns for mounting the TEC, and it has two threaded holes as well for mounting the heat sink to a device. The heat sink is designed to provide maximum cooling efficiency and low noise operation.
The ATS-18F-10-C1-R0 module features a thermostatic control switch which can be set to a specific temperature to allow proper operation of electronic components. The device is also equipped with a thermal fuse which will shut off the chip when the temperature reaches a preset level. This ensures adequate protection against overheating and reduces the risk of damage to the components.
The ATS-18F-10-C1-R0 can be used in a variety of applications requiring heat dissipation and cooling. It is suitable for cooling PC components such as processors, graphics cards, memory modules, and hard drives. It is also suitable for use on audio amplifiers, video cameras, gaming consoles, and any other device that needs to be kept at optimal operating temperatures. The thermal efficiency and low noise operation of this device make it ideal for cooling electronics in home theatre systems and industrial applications.
The working principle of the ATS-18F-10-C1-R0 is based on the process of thermoelectric cooling. In this process, heat generated from the device is collected by the heat sink and then passed on to the thermoelectric chip which converts it into electricity. This electricity is then passed to the fan which cools the device. The fan can be set to a specific speed to provide the optimal amount of airflow for the given application. The heat sink also acts as a heatsink, further dissipating heat away and cooling the device.
The ATS-18F-10-C1-R0 is a reliable and efficient way to keep your electronic components cool. It is designed for maximum heat dissipation and quiet operation, making it ideal for many applications. With its simple installation and durable design, the ATS-18F-10-C1-R0 is the perfect choice for cooling electronic components in a wide range of applications.
The specific data is subject to PDF, and the above content is for reference