| Allicdata Part #: | ATS-18F-10-C3-R0-ND |
| Manufacturer Part#: |
ATS-18F-10-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18F-10-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential for any electronic device, be it a laptop, a printer, or a home entertainment system. A thermal heat sink is a device that helps to control the temperature of such electronic devices by dissipating heat away from them. The ATS-18F-10-C3-R0 is a thermal heat sink that has been designed to operate in a wide range of applications and provide optimal performance. It is suitable for use in consumer electronics, automotive, medical, telecommunication, and other industries.
The ATS-18F-10-C3-R0 features a total depth of 18mm, a total height of 10mm and a total width of 34.5mm. The heat sink is made of high thermal conductivity aluminum, providing an effective thermal conduction path for heat generated from the device. The surface is also designed to enhance the heat transfer, helping to reduce the temperature of the components and preventing the device from overheating.
The ATS-18F-10-C3-R0 is designed with a center fin that allows for an air gap between the two halves of the heat sink. This air gap helps to increase the overall heat dissipation, thereby reducing the heat generated by the device. The fin also helps to absorb any additional thermal energy that is generated by the device, preventing it from overheating. In addition, the fins are angled to help optimize the airflow and increase the surface area for efficient heat transfer.
The ATS-18F-10-C3-R0 is designed with an efficient ventilation system, allowing for a more efficient transfer of heat. The heat sink also features built-in cooling fins that are designed to dissipate the additional thermal energy generated by the device during high-power operations. The fins also act as a thermal shield, reducing the risk of unwanted heat build-up.
The ATS-18F-10-C3-R0 is designed with a built-in thermal interface material that helps to provide optimal performance. The thermal interface material helps to provide a low thermal resistance between the device and the heat sink, allowing for efficient heat transfer. It also helps to reduce the risk of unwanted heat build-up, thereby preventing the device from overheating.
The ATS-18F-10-C3-R0 also features a built-in fan that helps to improve the efficiency of the device. The fan helps to evenly spread the heat across the heat sink, allowing for a more efficient transfer of heat. The fan also helps to reduce the temperature of the device, further reducing the risk of the device overheating.
Overall, the ATS-18F-10-C3-R0 is an effective and efficient thermal heat sink. It is designed to provide an optimal thermal performance, while also reducing the risk of overheating. The ATS-18F-10-C3-R0 is suitable for use in a wide range of applications, making it an ideal choice for those looking to optimize the performance and heat transfer of their electronic devices.
The specific data is subject to PDF, and the above content is for reference