ATS-18F-117-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-18F-117-C1-R0-ND

Manufacturer Part#:

ATS-18F-117-C1-R0

Price: $ 3.09
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X10MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-18F-117-C1-R0 datasheetATS-18F-117-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.78208
30 +: $ 2.70669
50 +: $ 2.55629
100 +: $ 2.40591
250 +: $ 2.25553
500 +: $ 2.18034
1000 +: $ 1.95479
Stock 1000Can Ship Immediately
$ 3.09
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 10.46°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

.

Thermal management is essential in a variety of industries and applications, and heat sinks are an important part of any thermal management system. Found in computers, electronics, industrial machines, and other equipment, heat sinks are designed to dissipate heat to help regulate the temperature of sensitive components and maintain optimal thermal performance. The ATS-18F-117-C1-R0 is a high-performance, low-noise heat sink that is designed for a variety of industrial, military, and commercial applications.

The ATS-18F-117-C1-R0 is a heat sink that is constructed from aluminum alloy and designed with a heavy-duty mosaic structure to increase the surface area and heat dissipation capability. This heat sink also features high quality solderable lugs that enable components to be easily mounted and connected to the base. This heat sink has a 20.3mm x 20.3mm base size, and the height of the device is 117mm. It also has a maximum temperature resistance of 120°C and an airflow rate of 22 LFM.

The working principle of the ATS-18F-117-C1-R0 is based on the process of conduction. The heat sink is designed with an aluminum alloy body that is able to rapidly absorb heat energy from the component and quickly dissipate it into the surrounding environment. As heat is conducted into the heat sink, its temperature increases, and as a result, thermal energy is released in the form of air or liquid (depending on the type of heat sink) by convection and radiation. This thermal energy is then transferred away from the component, allowing it to remain at a safe temperature.

The ATS-18F-117-C1-R0 heat sink is ideal for a variety of industrial, commercial, and military applications, such as electronic or industrial automation equipment, medical devices, computers, and military equipment. Its low noise and reliable performance make it suitable for applications that require a quiet operation and efficient cooling. For example, this heat sink can be used in mission-critical systems, such as those used in aerospace or military equipment, where silence and efficiency are of the utmost importance. Additionally, the ATS-18F-117-C1-R0 heat sink is also suitable for use in medical equipment, where reliability and efficient cooling are paramount.

In conclusion, the ATS-18F-117-C1-R0 heat sink is a high-performance, low-noise solution that is designed for a variety of industrial, commercial, and military applications. Its aluminum alloy body and heavy-duty mosaic structure make it an effective solution for dissipating heat and helping to maintain optimal thermal performance. Its high quality solderable lugs make it easy to mount and connect components to the base. Additionally, its reliable performance and low noise operation make it suitable for mission-critical systems and medical equipment, where efficiency and reliability are of the utmost importance.

The specific data is subject to PDF, and the above content is for reference

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