| Allicdata Part #: | ATS-18F-12-C1-R0-ND |
| Manufacturer Part#: |
ATS-18F-12-C1-R0 |
| Price: | $ 3.48 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18F-12-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.16197 |
| 30 +: | $ 3.07671 |
| 50 +: | $ 2.90581 |
| 100 +: | $ 2.73489 |
| 250 +: | $ 2.56397 |
| 500 +: | $ 2.47851 |
| 1000 +: | $ 2.22211 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management plays an important role in ensuring the safe and reliable performance of electrical equipment. Heat sinks are essential components used in the thermal management of electronic components and systems, such as ATS-18F-12-C1-R0. ATS-18F-12-C1-R0 is a heat sink manufactured by KELESA, which specializes in the production of custom heat sinks for electronic components. This article will explain the application field and working principle of ATS-18F-12-C1-R0.
Application Field
The ATS-18F-12-C1-R0 is ideal for cooling power semiconductor devices used in brushless DC motors, power electronic systems, household application motors, power supplies, and other electronic components. It offers enhanced thermal performance due to its copper base and fins. The heat sink is designed with extended fins to increase the surface contact area for enhanced heat dissipation. The fins are coated with black anodized aluminum to improve heat transfer significantly. The device can also withstand high temperature, high voltage, and corrosive environments.
Working Principle
Generally, a heat sink is used to transfer heat from an object—such as an electronic device—that generates heat to the surrounding environment. The heat generated by an electronic device is transferred to the heat sink through conduction. The heat is then dissipated from the heat sink to the surrounding environment via convective heat transfer. The heat sink has fins that are spaced out in order to increase the surface area, which facilitates better thermal dissipation. The fins are further coated with black anodized aluminum to improve heat transfer grounds. The heat sink also dissipates heat through radiation, where the heat is emitted as electromagnetic radiation.
Apart from dissipating heat from electronic devices, the ATS-18F-12-C1-R0 is also used as a heatsink for controlling temperature. This heat sink is designed for application in systems that generate high power and heat. As such, it can easily dissipate the heat and help keep the components at the desired temperature. The device also has an optimized design for improved efficiency; the heat generated is evenly distributed throughout the device.
Conclusion
In conclusion, the ATS-18F-12-C1-R0 is an efficient heat sink used for cooling electrical components and devices. It is specifically designed for dissipating the high temperatures generated by high power and energy-consuming components. The device offers thermal performance due to its copper base and extended fins, which improve heat transfer. It can also withstand high temperatures, voltages, and corrosive environments. This device can also be used as a heatsink for controlling temperature in systems that generate heat.
The specific data is subject to PDF, and the above content is for reference