ATS-18F-128-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-18F-128-C3-R0-ND

Manufacturer Part#:

ATS-18F-128-C3-R0

Price: $ 4.33
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-18F-128-C3-R0 datasheetATS-18F-128-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.89781
30 +: $ 3.68151
50 +: $ 3.46487
100 +: $ 3.24834
250 +: $ 3.03178
500 +: $ 2.81523
1000 +: $ 2.76109
Stock 1000Can Ship Immediately
$ 4.33
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.98°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

.

Thermal management systems are an important component of many electronic products, as they offer improved heat transfer and ventilation performance in a variety of applications. ATS-18F-128-C3-R0 is the newest member from the family of thermal heat sinks, specially designed for high power applications. Its unique features make it suitable for a wide range of applications, such as high efficiency LED lighting, electronic-based power appliance, high frequency industrial and telecom systems.

The ATS-18F-128-C3-R0 has an optimized aluminum foil metal stamping structure, which can provide excellent cooling performance, even under high power applications. Its optimized structure also allows increased airflow and improved thermal efficiency compared to traditional heat sinks. The aluminum foil stamping process increases the receptivity of thermal energy, effectively cooling down the power device and improving the scalability of the application.

The ATS-18F-128-C3-R0 contains 128 conducting pins, providing excellent connectivity to the power device. Its silver-plated surface helps to further improve thermal conductivity, providing greater heat dissipation than other heat sinks. The pins are also capable of being used as connectors to other devices, allowing for easier assembly and installation.

The ATS-18F-128-C3-R0 is also designed with a built-in insulation strip that can reduce thermal losses, providing a more reliable and stable application. This insulation strip prevents short circuits, making the connection more reliable. Additionally, the heat sink is designed to be resistant to corrosion, ensuring its performance in high humidity and moist environments.

The ATS-18F-128-C3-R0 is designed for high power applications, such as LED lighting, automotive electronics, power supplies and other high frequency applications. Its high-performance characteristics ensure optimal performance in these applications. Additionally, these characteristics also make the device suitable for miniaturization, allowing for highly power applications in limited space.

The ATS-18F-128-C3-R0 is also designed with an integrated power sensing system. This system can detect the power signal generated by the connected device and act accordingly to provide the best cooling solution. This power sensing system also helps to save energy, reducing the overall operating costs by minimizing the power consumed by the thermal management system.

Overall, the ATS-18F-128-C3-R0 is an efficient thermal heat sink for high power applications. Its unique features make it suitable for a variety of industries and applications, providing excellent thermal performance and improved reliability. The device’s integrated power sensing system also ensures cost-effective operation, reducing energy consumption and costs.

The specific data is subject to PDF, and the above content is for reference

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