| Allicdata Part #: | ATS-18F-133-C3-R0-ND |
| Manufacturer Part#: |
ATS-18F-133-C3-R0 |
| Price: | $ 6.41 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18F-133-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.77206 |
| 30 +: | $ 5.45118 |
| 50 +: | $ 5.13047 |
| 100 +: | $ 4.80986 |
| 250 +: | $ 4.48920 |
| 500 +: | $ 4.16855 |
| 1000 +: | $ 4.08839 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Thermal - Heat Sinks are a type of cooling device that are used to dissipate the heat generated from electronic devices and components. ATS-18F-133-C3-R0 is an example of a heat sink used in the consumer electronic industry for both consumer and industrial applications. This particular heat sink is designed for use with a series of semiconductor components, including polyester, PVC, and acrylic.
The ATS-18F-133-C3-R0 heat sink is designed to provide an efficient way to dissipate heat generated by the electronic components. This is accomplished by increasing the surface area of contact between the electronic component and the heat sink. This increased surface area provides an increase in thermal conductivity which is then transferred to the surrounding environment. This process is known as thermal dissipation.
The ATS-18F-133-C3-R0 heat sink is constructed of aluminum with an anodized finish that increases its corrosion resistance and durability. The surface of the heat sink is designed to provide maximum thermal dissipation, by increasing the surface area that the component comes into contact with therefore allowing more efficient thermal transfer. The anodized aluminum also provides mechanical protection against damaging high temperatures.
The ATS-18F-133-C3-R0 heat sink has an open frame design, which allows air circulation in the surrounding environment. This air circulation helps to reduce the temperature of the electronic components, as well as the surrounding environment which helps to reduce the electric load experienced by the device. This open frame design also helps to protect the electronic components from dust and dirt, and also helps to reduce the risk of electrical shock.
The thermal dissipation capability of the heat sink is rated by the thermal resistance that is supplied with the device. This rating is expressed in degrees Celsius per watt (°C/W). This rating indicates how efficiently the heat generated by the component can be transferred away from the component itself. The ATS-18F-133-C3-R0 has a thermal resistance rating of 0.3 °C/W, which is considered to be moderately efficient.
The ATS-18F-133-C3-R0 is designed for use in a variety of applications, including consumer and industrial applications. For consumer applications, this heat sink can be used in the design of home entertainment equipment such as Blu ray players and game consoles. For industrial applications, this heat sink can be used for high-performance processors used in servers and workstations.
The ATS-18F-133-C3-R0 heat sink is a reliable solution for dissipating heat generated by electronic components. This heat sink is designed to increase thermal conductivity and dissipate heat to the surrounding environment, increasing the performance of the electronic device and preventing damage due to overheating. The anodized aluminum construction makes this heat sink both durable and corrosion resistant, and the open frame design allows for a maximum rate of air circulation. This heat sink is designed for use in both consumer and industrial applications for cooling of high-performance processors and other electronic components.
The specific data is subject to PDF, and the above content is for reference