ATS-18F-137-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	18.29°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are components used in electronics, usually to dissipate the heat generated from processors. This kind of component often has high thermal conductivity, which helps to transfer the heat from the processor faster. The ATS-18F-137-C1-R0 is a special type of thermal-heat sink, designed for industrial applications and specifically engineered to cope with higher temperatures. This article will discuss the application field and working principle of this component.

Application Field of ATS-18F-137-C1-R0

The ATS-18F-137-C1-R0 is designed mainly for industrial applications and can work in harsh environments. It offers good thermal performance in high temperatures, with a maximum working temperature of up to 125°C and thermal conductivity of up to 620 W/mK. It can be used for cooling applications from 55W to 150W, and can dissipate up to 170W of heat. It is designed to be extremely reliable, with a durable construction and high corrosion-resistance. The ATS-18F-137-C1-R0 also has a low profile design, which makes it perfect for applications that require space-saving solutions.

Working Principle of ATS-18F-137-C1-R0

The ATS-18F-137-C1-R0 relies on heat sink technology to dissipate the heat generated from processors and other components in the system. The heat sink is made up of a base, which is usually made of copper, and a series of fins that are attached to the base. The base provides a large area for heat transfer, and the fins act as a heat spreader. The heat from the processor is transferred to the base of the heat sink through conduction, and then the heat is spread out across the fins, which increases the surface area, allowing more heat to be dissipated. The air surrounding the fins then helps to dissipate the heat, which is then released into the atmosphere.

Conclusion

The ATS-18F-137-C1-R0 is a special type of thermal-heat sink, designed for industrial applications and specifically engineered to cope with higher temperatures. It is designed to be highly reliable and able to dissipate up to 170W of heat. The ATS-18F-137-C1-R0 works by relying on heat sink technology to transfer heat from the processor to the base of the heat sink, and then the fins help to spread the heat out across a larger surface area. The air surrounding the fins then helps to dissipate the heat, which is then released into the atmosphere.

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