| Allicdata Part #: | ATS-18F-151-C3-R0-ND |
| Manufacturer Part#: |
ATS-18F-151-C3-R0 |
| Price: | $ 4.02 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18F-151-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.65526 |
| 30 +: | $ 3.45198 |
| 50 +: | $ 3.24904 |
| 100 +: | $ 3.04592 |
| 250 +: | $ 2.84286 |
| 500 +: | $ 2.63980 |
| 1000 +: | $ 2.58903 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-18F-151-C3-R0 is most commonly found in applications involving Thermal - Heat Sinks. This component is designed to dissipate heat from electronic components through a course of thermal energy transfer. In order to perform this process, the ATS-18F-151-C3-R0 contains a number of features which make it a highly efficient heat sink for many electronics projects.
The ATS-18F-151-C3-R0 is constructed from aluminum, which is a highly conductive material, meaning that it collects heat from the component it is protecting and disperses it across its surface area. This dispersal process is facilitated by a number of fins which protrude from the surface of the ATS-18F-151-C3-R0. The fins also act as an additional surface area which further increases the heat transfer efficiency of the component.
On top of the heat dispersal efficiency of the ATS-18F-151-C3-R0 it is also designed to minimize the amount of acoustic noise produced during the cooling process. This is achieved through a "lip seal", which helps reduce the vibration of air passing across the ridges of the fins. This makes the component virtually silent when installed correctly.
In addition to the features, the ATS-18F-151-C3-R0 is designed to be highly compact, so that it can be easily installed into most electronics applications. The fins are also spaced in a way that increases the surface area while also never blocking the path of air, meaning that more heat may be dissipated in a relatively small surface area.
The ATS-18F-151-C3-R0 also contains several mounting holes on its base. This allows the component to be easily installed onto the electronics component it is being used to cool, due to its secure and firm installation. Furthermore, the aluminum construction of the component, as well as the mounting holes make it very durable.
The ATS-18F-151-C3-R0 is designed to work in most electronics applications involving Thermal - Heat Sinks. It is constructed from highly conductive material, utilizes its fins to increase surface area and dissipate heat, minimizes acoustic noise, and contains mounting holes for easy installation onto any device.
The specific data is subject to PDF, and the above content is for reference