| Allicdata Part #: | ATS-18F-158-C3-R0-ND |
| Manufacturer Part#: |
ATS-18F-158-C3-R0 |
| Price: | $ 4.43 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18F-158-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.99042 |
| 30 +: | $ 3.76887 |
| 50 +: | $ 3.54715 |
| 100 +: | $ 3.32545 |
| 250 +: | $ 3.10376 |
| 500 +: | $ 2.88206 |
| 1000 +: | $ 2.82664 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
An ATS-18F-158-C3-R0 heat sink is a device designed to dissipate heat from an electronics component or system and is used to cool surfaces, which cannot keep up with the demands of the application. This type of heat sink is most commonly used in electronics that need to be cooled beyond the capabilities of air cooling, such as processors on computer motherboards, and is also used to dissipate heat from other components such as lasers, high-power transistors, and power supplies.
The ATS-18F-158-C3-R0 heat sink is made of aluminum alloy, which is bonded with an U-type clip for fixing the heat sink to the application board. It feature an insulated steel base, so that when the device is installed in a high temperature environment, it will not affect the circuit board on which the device is mounted. The insulated base also reduces the chance of splash when the device is being mounted onto the circuit board. The heat sink is designed with a series of fins that are positioned for maximum heat transfer from the device to the fins.
The heat sink is installed onto the heat-generating component, and a fan is added to ensure the airflow of air through the fins of the heat sink. The combination of the fan and the fins increase the surface area of the heat sink, resulting in a higher cooling efficiency. As the component heats up, the air around the fins is heated, causing the fan\'s blades to rotate faster, driving more cooler air directly over the fins and dissipating more heat.At high temperatures, the fins of the heat sink efficiently take heat away from the device, transferring it to the surrounding air. This helps to maintain the component\'s temperature within the necessary range for safe and efficient working.
The ATS-18F-158-C3-R0 heat sink is designed for applications that require the highest levels of cooling efficiency. It is ideal for use in high powered electronic systems such as processor-based servers, or for precision lasers that require an optically precise working environment. This heat sink can also be used for medical and industrial applications, where efficient cooling is critical.
The ATS-18F-158-C3-R0 heat sink is a cost-effective, high performance option for a variety of high-powered cooling applications. With its aluminum construction and insulated steel base, this heat sink ensures reliable temperature control, while its wide range of available sizes makes it a versatile solution for any application. With its efficient thermal management, the ATS-18F-158-C3-R0 heat sink is a reliable and cost-effective choice for any application that requires superior cooling performance.
The specific data is subject to PDF, and the above content is for reference