| Allicdata Part #: | ATS-18F-160-C3-R0-ND |
| Manufacturer Part#: |
ATS-18F-160-C3-R0 |
| Price: | $ 4.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X15MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18F-160-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.88647 |
| 30 +: | $ 3.67059 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.75°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are devices which are designed to dissipate heat from objects that produce heat, such as processors and other electronic components. This is done by utilising the physical properties of thermodynamics to absorb and dissipate heat away from the source. Heat sinks are usually made of metal, such as aluminum or copper, and are used to increase the surface area of the object being cooled.
The ATS-18F-160-C3-R0 heat sink is used in a variety of industries where thermal cooling is required. This type of heat sink is a high-performance solution, ideal for maintaining optimal temperatures in electronics and other components. It features a large active surface area and low-pressure drop, allowing for efficient cooling even in high demand applications. The ATS-18F-160-C3-R0 heat sink also features a more efficient heat spreader than standard flat-panel heat sinks, which can provide better thermal performance and help to reduce component failure rate.
The ATS-18F-160-C3-R0 heat sink is designed to cool electronic devices and components through the application of natural air flow. It uses a fan to help circulate the air around the heat sink, which helps to draw heat away from the device or component. The fan is adjustable and can be set to the desired speed to ensure maximum cooling efficiency. The ATS-18F-160-C3-R0 heat sink also features a corrugated fin design, which helps to reduce turbulence and increase air flow for even better cooling performance.
Thermal management is an important factor to consider when designing and installing electronic devices and components. Heat sinks are essential for optimal cooling performance to help ensure the longevity of the device and component. The ATS-18F-160-C3-R0 heat sink offers a highly effective heat sink solution, which is suitable for a range of industrial applications. With its efficient fin and fan design, the ATS-18F-160-C3-R0 heat sink helps to improve the overall thermal performance of the device or component, helping to ensure optimal working conditions for longer.
The specific data is subject to PDF, and the above content is for reference