ATS-18F-17-C1-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management products have become an essential part of the modern lifestyle and technological society. With advancements in technology, high-performance components and devices are also becoming more compact and require lower power consumption. To ensure that these devices do not overheat and damage, there is a need for reliable and efficient cooling solutions. The ATS-18F-17-C1-R0 is one such product for thermal management. This article will look at the application fields and the working principle of this thermal-heat sink.The ATS-18F-17-C1-R0 thermal-heat sink is a special heat sink designed to keep high-performance devices cool. The ATS-18F-17-C1-R0 is designed to provide efficient and reliable cooling to small and medium-sized electronic components. The heat sink is made of aluminum alloy which ensures tremendous heat dissipation efficiency with minimal bulk. It has a thermal conductivity of 8 W/mK which is a higher rate than most ordinary heat sinks available in the market. The ATS-18F-17-C1-R0 can be used for the cooling of power transistors, voltage regulators, and other active components which require heat dissipation.The ATS-18F-17-C1-R0 thermal-heat sink is designed with a high thermal conductivity for efficient cooling. It has an asymmetric design with a flat base and an angled side for high heat transfer with minimal air resistance. The heat sink also features an anti-air gap technology which ensures uniform heat distribution and cooling of components. The ATS-18F-17-C1-R0 also features an angular design which aids in reducing the zinc oxide layer which forms on the surface of the heat sink when exposed to high temperatures. This reduces the risk of electrical breakdown due to excess heat.The ATS-18F-17-C1-R0 is an R0 resistance type heat sink. This means that the heat generated by the component is spread evenly across the surface of the heat sink. The heat is then dissipated via thermal emission from the surface of the heat sink. The ATS-18F-17-C1-R0 also features a high resistance to thermal shock which ensures that the thermal performance is sustained even in extreme temperature environments.The ATS-18F-17-C1-R0 is a great choice for applications requiring efficient cooling and high thermal performance. It is ideal for use in power transistors, voltage regulators, and other active components which require heat dissipation. The ATS-18F-17-C1-R0 is also suitable for use in stationary applications or used as a fan-less cooling solution. It is also ideal for applications in flat-screen displays, such as LEDs, LCDs, and plasma displays.In conclusion, the ATS-18F-17-C1-R0 is an excellent choice for thermal management applications due to its high thermal performance and efficiency. The product is designed with a high thermal conductivity and an angular design which aid in the efficient cooling of components. The ATS-18F-17-C1-R0 also features an anti-air gap technology which helps to ensure uniform heat distribution. The heat sink is also suitable for a wide range of applications, including power transistors, voltage regulators, and more.

The specific data is subject to PDF, and the above content is for reference