| Allicdata Part #: | ATS-18F-17-C3-R0-ND |
| Manufacturer Part#: |
ATS-18F-17-C3-R0 |
| Price: | $ 4.23 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18F-17-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.80520 |
| 30 +: | $ 3.59415 |
| 50 +: | $ 3.38260 |
| 100 +: | $ 3.17123 |
| 250 +: | $ 2.95982 |
| 500 +: | $ 2.74840 |
| 1000 +: | $ 2.69555 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.51°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks play a pivotal role in the performance and longevity of electronic components. They act as a bridge between electrical components and their environment, helping to dissipate and manage the large amounts of waste heat generated by the component. The ATS-18F-17-C3-R0 is a thermal-heat sink that is used in the cooling of electrical components and assemblies.
The ATS-18F-17-C3-R0 is primarily used in the electronics industry for cooling of components such as microprocessors and other micro-sized electronic assemblies. It is designed to be mounted onto the PCB in order to dissipate the heat generated inside the component. This heat sink offers a high degree of thermal conductivity and efficient heat dissipation. The low thermal resistance also helps to ensure that the component does not become too hot.
The ATS-18F-17-C3-R0 is a fin-type heat sink, which means that it is made up of small metal fins which are designed to increase the surface area of the component to which they are attached. This increases the amount of air circulation around the component and assists in dissipating the heat more quickly. The fins are also designed with a special air gap to help reduce turbulence and help increase the overall efficiency of the component.
The ATS-18F-17-C3-R0 has a professional appearance and is designed to fit most applications of electronic components. It is a great choice for a variety of industrial, commercial, and residential applications. It is also a reliable and affordable thermal-heat sink for all equipment ranging from computers to consumer electronics. It has an operating temperature range of up to 85°C and is designed to last up to 10 years in most cases.
The ATS-18F-17-C3-R0 is designed to work on the principle of direct air convection. This means that when air rushes over the fins of the heat sink, it cools the component by carrying away the heat from its surface. The heat is then dissipated into the surrounding atmosphere. This process helps to keep the component and its components cool, thereby increasing its efficiency and reliability.
The ATS-18F-17-C3-R0 is an excellent choice for cooling electronic components and assemblies. Its high degree of thermal conductivity and efficient heat dissipation make it an ideal heat sink for all types of industrial and commercial applications. It is also a reliable and affordable option for all types of equipment, from computers to consumer electronics.
The specific data is subject to PDF, and the above content is for reference