| Allicdata Part #: | ATS-18F-18-C1-R0-ND |
| Manufacturer Part#: |
ATS-18F-18-C1-R0 |
| Price: | $ 3.75 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X15MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18F-18-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.41208 |
| 30 +: | $ 3.31968 |
| 50 +: | $ 3.13526 |
| 100 +: | $ 2.95079 |
| 250 +: | $ 2.76641 |
| 500 +: | $ 2.67419 |
| 1000 +: | $ 2.39754 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.37°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are extremely important components for the cooling of electronic and mechanical systems. ATS-18F-18-C1-R0 is an effective thermal heat sink designed to dissipate heat from heat-generating electronic components by transferring it away from the component and to a cooler external environment.
Description of ATS-18F-18-C1-R0
The ATS-18F-18-C1-R0 is composed of a black anodized aluminum die-cast alloy body, and it measures 18 inches high, 18 inches wide, and 7.25 inches deep. The thermal heat sink has a black anodized finish to provide superior corrosion resistance and good thermal conductivity with a thermal resistance of 0.19 °C/W.
It also includes an integrated fan designed to actively cool the heat sink by drawing air over the fins, which allows for efficient air flow. The fan is powered by a 110V standard voltage power supply and operates at a noise level of 41.8 dBA. The fan speed can be adjusted to the desired speed, depending on the cooling requirement.
Operation of ATS-18F-18-C1-R0
The ATS-18F-18-C1-R0 has a simple yet effective design to ensure heat removal from electronic components. The thermal heat sink uses the principles of conduction and convection to dissipate heat away from the component. Heat is transferred by conduction away from the component to the heat sink and then the heat is dissipated by convection away from the heat sink to the environment.
The thermal heat sink has a secure mounting design and it can be easily mounted to a standardized heat sink frame. The frame ensures a secure and stable connection between the component and the heat sink, and it allows for easy installation.
Applications of ATS-18F-18-C1-R0
The ATS-18F-18-C1-R0 is an effective thermal heat sink designed to dissipate heat away from heat-generating electronic components. The thermal heat sink is suitable for use in a wide range of applications such as computer motherboards, graphics cards, CPU’s, and LCD screens. Additionally, it can be used in a variety of industrial and commercial applications including laser printers, industrial lighting, and power supplies.
The thermal heat sink is designed to provide superior cooling efficiency by using a combination of conduction and convection. It also allows for easy installation, and it can be easily mounted on a standardized frame for secure and reliable heat dissipation.
Conclusion
ATS-18F-18-C1-R0 is an effective thermal heat sink designed to dissipate heat away from electronic components. It utilizes the principles of conduction and convection, and allows for efficient and effective air flow. The thermal heat sink is suitable for a wide range of applications and provides reliable and secure cooling.
The specific data is subject to PDF, and the above content is for reference