| Allicdata Part #: | ATS-18F-199-C3-R0-ND |
| Manufacturer Part#: |
ATS-18F-199-C3-R0 |
| Price: | $ 3.75 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X6MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18F-199-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.41208 |
| 30 +: | $ 3.31968 |
| 50 +: | $ 3.13526 |
| 100 +: | $ 2.95079 |
| 250 +: | $ 2.76641 |
| 500 +: | $ 2.67419 |
| 1000 +: | $ 2.39754 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.95°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-18F-199-C3-R0 is a thermal device that is primarily used in the cooling and thermal management of electronics. It has a wide range of applications, including cooling processors, cooling LED lights, regulating temperature in communication systems, and dissipating power from motors and power supplies.
The ATS-18F-199-C3-R0 uses heat sinks, which are devices that absorb and dissipate heat, to regulate the temperature of sensitive electronic components. Heat sinks are usually composed of a metal fin structure that is designed to dissipate heat away from components. The term “fin” refers to the physical structure of the heat sink; the fins are metal bars that are arranged in a cross pattern to maximize surface area. This increases the rate of heat dissipation, which helps keep the electronics component cool.
Heat sinks work by transferring thermal energy from the electronic component to the atmosphere. This is accomplished by the process of conduction, convection, and radiation. Heat is transferred from the component to the heat sink via heat conduction. The heat sink material absorbs the thermal energy and then dissipates it into the atmosphere. This is done by air convection, which is the transfer of thermal energy through air as the heat sink fins transfer heat away from the component. Finally, heat is dissipated by radiation, which is the transfer of thermal energy as electromagnetic waves.
The ATS-18F-199-C3-R0 also has a unique feature that separates it from many other thermal devices. It has an embedded thermoelectric module, allowing it to actively adjust the temperature of the component it is cooling. The device has a Peltier element, also known as a thermoelectric cooler, that is attached to its base. This element uses the Peltier effect to transfer heat from one side of the device to the other, thus cooling the component. The device also has two fans that are used to further dissipate the heat from the component.
In conclusion, the ATS-18F-199-C3-R0 is a versatile thermal device that is used in many applications. It utilizes heat sinks to passively dissipate heat from components, as well as an embedded thermoelectric module for active cooling. With its ability to effectively regulate the temperature of sensitive components, it can be used in a wide range of fields.
The specific data is subject to PDF, and the above content is for reference