| Allicdata Part #: | ATS-18F-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-18F-20-C3-R0 |
| Price: | $ 4.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18F-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.19895 |
| 30 +: | $ 3.96543 |
| 50 +: | $ 3.73225 |
| 100 +: | $ 3.49896 |
| 250 +: | $ 3.26570 |
| 500 +: | $ 3.03243 |
| 1000 +: | $ 2.97412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are important tools in improving and protecting the efficiency of electronic systems. The ATS-18F-20-C3-R0 is a well-known and respected product in this category, and its application field and working principle are worthy of exploration.
The ATS-18F-20-C3-R0 has a wide range of potential applications, and it is well suited for working in many types of electronic systems. It is particularly suitable for use in high power systems, as it can reduce the amount of heat generated by components by up to 45%. This makes it an ideal choice for use in mobile phones, tablets, laptops, and other devices that require high power and energy efficiency.
The ATS-18F-20-C3-R0 works on the principle of finned heat sinks. These sinks arrange large fins or plates closely together to increase surface area. This surface area allows for maximum air circulation, allowing the heat generated by the components to dissipate quickly and evenly. An efficient thermal cooling system is essential for high power systems to ensure their longevity and effectiveness.
The ATS-18F-20-C3-R0 is designed to be lightweight yet strong enough to stand up to the rigors of everyday use. It is constructed out of durable aluminum which enables it to cope with tough conditions. Furthermore, it also has a corrosion-resistant coating that helps further protect it from wear and tear.
The ATS-18F-20-C3-R0 is renowned for its ability to dissipate heat quickly and efficiently. It is designed so that the heat is evenly spread over the entire heatsink, to ensure that no one component suffers too much heat buildup. Having a lightweight and strong design ensures that the heatsink remains easy to install, and it is also designed to be quieter when it is running.
To maximize efficiency, the ATS-18F-20-C3-R0 is often paired with a fan. The fan helps to draw cool air through the fins of the heatsink, allowing for quicker cooling of the electronics. This also ensures that the temperature of the system is kept at an acceptable level, to prevent any potential damage.
In conclusion, the ATS-18F-20-C3-R0 is an ideal choice for a variety of electronics systems. Its combination of lightweight design, strong construction, and efficient cooling system make it an excellent product for reducing heat buildup, and prolonging the life of the electronic components.
The specific data is subject to PDF, and the above content is for reference