ATS-18F-200-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-18F-200-C3-R0-ND

Manufacturer Part#:

ATS-18F-200-C3-R0

Price: $ 3.81
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X10MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-18F-200-C3-R0 datasheetATS-18F-200-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.45933
30 +: $ 3.36588
50 +: $ 3.17898
100 +: $ 2.99193
250 +: $ 2.80496
500 +: $ 2.71146
1000 +: $ 2.43095
Stock 1000Can Ship Immediately
$ 3.81
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.90°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are an integral part of the modern electronics that help to ensure that components are able to function effectively while at the same time protecting them from damage due to overheating. ATS-18F-200-C3-R0 is a popular heat sink that has many applications in various fields, ranging from industrial to consumer applications. This article will discuss the application field and working principle of ATS-18F-200-C3-R0 heat sink.

Application Field

ATS-18F-200-C3-R0 is most commonly used in industrial applications that involve high power consumption and heat dissipation. It is effective in controlling the temperature of high-power electronic components such as diodes, transistors, and amplifiers. Additionally, it is an ideal heat dissipation solution for applications such as server racks, data centers, and medical equipment as it is capable of dissipating heat produced from a large number of components in a short period of time. This makes it highly efficient and reliable in such applications. It is also widely used in consumer electronics such as computers, TVs, and gaming consoles as it can help prevent overheating, which can lead to malfunction.

Working Principle

The ATS-18F-200-C3-R0 heat sink works by utilizing convective heat transfer. This process relies on the principle of air convection - the upward motion of heated air caused by its lightness and buoyancy. When the heat sink is in operation, the air inside it is cooled and rises, while the cool air outside is forced into the system. As a result, the heated air is removed and dissipated while the cool air is forced towards the components in order to absorb the heat and cool them down. This process is very efficient and effective in dissipating heat from high-power components quickly, thus helping to protect them from potential damages caused by overheating.

Conclusion

The ATS-18F-200-C3-R0 heat sink is an invaluable tool for many applications, including industrial and consumer electronics. It is capable of dissipating large amounts of heat quickly and effectively via convection to help prevent damage from overheating. Moreover, it is relatively easy to install, making it a great option for various applications.

The specific data is subject to PDF, and the above content is for reference

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