| Allicdata Part #: | ATS-18F-32-C2-R0-ND |
| Manufacturer Part#: |
ATS-18F-32-C2-R0 |
| Price: | $ 5.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X11.43MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18F-32-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.22837 |
| 30 +: | $ 4.93773 |
| 50 +: | $ 4.64726 |
| 100 +: | $ 4.35683 |
| 250 +: | $ 4.06637 |
| 500 +: | $ 3.77592 |
| 1000 +: | $ 3.70330 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are used to dissipate the heat generated by an electronic component. The ATS-18F-32-C2-R0 is an example of a thermal-heat sink that is used in various applications. This article will discuss the application field and working principle of the ATS-18F-32-C2-R0.
The ATS-18F-32-C2-R0 is a thermal-heat sink specifically designed for use in computer systems. It is typically used on processors, graphic cards, and other devices that generate a significant amount of heat. The heat sink is designed to draw heat away from the device in order to keep it operating within optimal temperatures. As such, it is an essential part of any system that has a large number of components.
The ATS-18F-32-C2-R0 is constructed out of aluminum and features an aluminum fin design, which acts as a heat sink. The fins are designed to draw heat away from the component and disperse the heat away from the system. This is done by using an advanced thermal-convection system, which allows the heat sink to efficiently dissipate the heat. In addition, the aluminum fins are designed with a fluted pattern, which helps to further maximize heat dissipation.
The ATS-18F-32-C2-R0 also features a fan that is used to further assist with heat dissipation. The fan is designed to draw air through the fins of the heat sink and force the air back out again. This helps to keep the temperature of the device low, as the fan helps to prevent the area from becoming too hot. The fan also helps to keep noise levels down, as it draws in cooler air to replace the air that has been heated up.
The ATS-18F-32-C2-R0 is mainly used in high-end computer systems and applications where the temperatures can exceed the safe limits of the components. It has become an invaluable tool in ensuring that all components in a system are kept running at optimal temperatures, while also minimizing noise levels and increasing the efficiency of the system. The heat sink can also be used in smaller applications, such as cooling laser diodes, LED lights, and other electronic components.
Overall, the ATS-18F-32-C2-R0 is an excellent example of a thermal-heat sink. It is designed to draw heat away from the component and disperse the heat into the air, thereby allowing the system to operate at peak efficiency. The fan helps to further dissipate heat, as well as ensuring that noise levels remain low. This heat sink is perfect for high-end computer systems and applications where temperatures can be well above the safe limit for components, and is ideal for keeping all components safe and running smoothly.
The specific data is subject to PDF, and the above content is for reference