| Allicdata Part #: | ATS-18F-33-C2-R0-ND |
| Manufacturer Part#: |
ATS-18F-33-C2-R0 |
| Price: | $ 5.98 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X17.78MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18F-33-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.37831 |
| 30 +: | $ 5.07969 |
| 50 +: | $ 4.78094 |
| 100 +: | $ 4.48213 |
| 250 +: | $ 4.18333 |
| 500 +: | $ 3.88452 |
| 1000 +: | $ 3.80982 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 17.42°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-18F-33-C2-R0 is a type of advanced thermal - heat sink system, designed to efficiently dissipate thermal energy and maintain an optimal temperature in an enclosed area. This device is often used in scientific and industrial applications, and can be used in a variety of temperatures. This article will explore the ATS-18F-33-C2-R0 application field and working principle.
The ATS-18F-33-C2-R0 thermal - heat sink system is designed to promote the efficient exchange of thermal energy. Its design utilizes a copper substrate with a thin layer of insulation and a highly conductive aluminum sheet. This provides a large thermal conductivity, allowing for efficient heat dissipation and temperature control. The device also features a built-in fan that can be set to predefined speeds, allowing for further thermal control. This allows the user to fine-tune the air-flow, providing effective thermal management.
The ATS-18F-33-C2-R0 offers many advantages over traditional cooling methods. It features high thermal conductivity, allowing for efficient heat dissipation. Additionally, its built-in fan system offers considerable air flow, increasing cooling efficiency. The device is also suitable for a variety of temperatures, allowing it to be used in a variety of applications. Finally, the device is relatively compact, meaning it can be placed in a variety of spaces, allowing for greater flexibility.
The ATS-18F-33-C2-R0 thermal - heat sink system is used in a variety of industries for different purposes. Commonly, it is used to maintain optimal temperature levels in interior spaces, such as offices, laboratories and production facilities. It can also be used to regulate temperatures in closed systems, such as military or industrial equipment or components. Additionally, the device can be used to maintain specific voltages, making it a popular choice for low-voltage equipment and components.
In terms of working principles, the ATS-18F-33-C2-R0 utilizes a form of convection cooling. This involves the transfer of thermal energy from a hotter to a cooler surface, allowing for temperature control. This is achieved through a variety of elements, including the copper substrate, the heat pipe design and the fan system. These elements help to promote the efficient transfer of thermal energy, allowing for temperature control.
The ATS-18F-33-C2-R0 is a popular thermal - heat sink system, designed to efficiently dissipate thermal energy and maintain an optimal temperature. This is achieved through a range of elements, including a copper substrate, a thin layer of insulation and a highly conductive aluminum sheet. Additionally, the device features a built-in fan system, enabling users to tailor the air-flow and fine-tune the device. Finally, the device is suitable for a variety of temperatures, making it suitable for a range of applications. This makes the ATS-18F-33-C2-R0 a popular choice in industrial and scientific settings.
The specific data is subject to PDF, and the above content is for reference