ATS-18F-34-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-18F-34-C1-R0-ND

Manufacturer Part#:

ATS-18F-34-C1-R0

Price: $ 5.53
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 57.9X36.83X22.86MM
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-18F-34-C1-R0 datasheetATS-18F-34-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.97385
30 +: $ 4.69749
50 +: $ 4.42109
100 +: $ 4.14477
250 +: $ 3.86845
500 +: $ 3.59213
1000 +: $ 3.52306
Stock 1000Can Ship Immediately
$ 5.53
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 2.280" (57.90mm)
Width: 1.450" (36.83mm)
Diameter: --
Height Off Base (Height of Fin): 0.900" (22.86mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 14.31°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

An increasingly common component found both in commercial and industrial equipment is the thermal heat sink. The ATS 18F-34-C1-R0 is one such item, and is designed for use in thermal management applications for consumer electronics like laptop and desktop PCs. Heat sinks help dissipate heat generated by electrical components, ensuring that everything runs as cool as possible. This type of heat sink is a good choice for use in sensitive electronic applications due to its excellent heat transfer properties.

The ATS 18F-34-C1-R0 is a robust unit, constructed from aluminum and designed for a wide range of temperatures. It uses an, advanced finned structure to draw heat away from the associated components and directs it into the atmosphere. It can be used to cool a moderately sized space, or to supplement the cooling of larger areas. Furthermore, the aluminum construction provides excellent heat transfer properties, as well as strong durability and longevity; it is capable of withstanding high temperatures, making it suitable for harsher conditions.

The primary mechanism of heat transfer for the ATS 18F-34-C1-R0 is conduction. Heat is dissipated from the component into a material with a higher thermal conductivity, like aluminum, when the temperatures of the two contact each other. The heat is then transferred through the material and emitted into the environment. Convection is also used to facilitate heat transfer; as the aluminum of the heat sink heats up, natural convection currents are created within the material. Hot air rises and cool air falls, further facilitating the transfer of heat.

The ATS 18F-34-C1-R0 also features an integrated fan. This can be used to supplement the thermal transfer of the heat sink by circulating air around the component. The blades of the fan create air pressure that draws heated air away from the component and pushes cooler air towards it. This helps keep temperatures lower and keeps the equipment cooler.

The ATS 18F-34-C1-R0 is designed for use in various applications, including computers, servers, routers, and other consumer electronics. These components typically generate a great deal of heat, which can lead to system fatigue or failure. The heat sink is capable of dissipating this heat through conduction and convection, ensuring that the devices remain functional and without any overheating issues. The fan can also be used to further supplement the heat transfer.

Thermal heat sinks such as the ATS 18F-34-C1-R0 are essential for ensuring the efficient operation of both commercial and industrial equipment. The aluminum construction provides excellent heat transfer and strong durability, while the integrated fan further enhances the performance. By dissipating heat away from components, the thermal heat sinks ensure that components don’t experience any issues due to overheating.

The specific data is subject to PDF, and the above content is for reference

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