| Allicdata Part #: | ATS-18F-36-C1-R0-ND |
| Manufacturer Part#: |
ATS-18F-36-C1-R0 |
| Price: | $ 5.26 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X11.43MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18F-36-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.73067 |
| 30 +: | $ 4.46796 |
| 50 +: | $ 4.20512 |
| 100 +: | $ 3.94235 |
| 250 +: | $ 3.67953 |
| 500 +: | $ 3.41671 |
| 1000 +: | $ 3.35100 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.81°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management systems are designed to transfer heat away from heat-generating components in order to protect and extend their life span. ATS-18F-36-C1-R0 heat sink is designed to provide superior thermal management for a wide variety of applications that depend on incorporating heat-generating components. This heat sink is commonly used in computers, industrial machinery, electrical equipment and automotive components.
The ATS-18F-36-C1-R0 ismade upof a series of extruded aluminum fins and a base. These materials provide superior thermal conductivity while remaining lightweight. The base of the heat sink is designed to interface with the component that needs cooling, providing direct transfer of heat. The base is made using a copper alloy that has been treated for increased thermal conductivity.
The fins of the heat sink can be shaped in various configurations, depending on the application. The fins are designed to maximize air flow and dissipate heat through convection. The contact between the base of the heat sink and the component creates a physicall bond that helps to retain maximum heat transfer.
In order to ensure satisfactory cooling, the heat sink should be mounted so that air is optimally drawn through the fins. It can also be fitted with a fan, if needed, to increase the rate of air flowaround the heat sink. In addition, a thermal paste or thermal pad can be applied to the base in order to reduce any air gaps between the component and the heat sink. This allows for increased thermal conductivity.
The ATS-18F-36-C1-R0 heat sink is designed to meet the demands of a variety of thermal management applications. It is suitable for use in computers, industrial machinery, electrical equipment, automotive components as well as other applications where superior thermal performance is required. The simple design of this heat sink makes it easy to install and can often be done without professional assistance, further reducing cost and complexity.
The specific data is subject to PDF, and the above content is for reference