| Allicdata Part #: | ATS-18F-42-C2-R0-ND |
| Manufacturer Part#: |
ATS-18F-42-C2-R0 |
| Price: | $ 7.15 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X60.96X22.86MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18F-42-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.43104 |
| 30 +: | $ 6.07383 |
| 50 +: | $ 5.71662 |
| 100 +: | $ 5.35928 |
| 250 +: | $ 5.00200 |
| 500 +: | $ 4.64471 |
| 1000 +: | $ 4.55539 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 2.400" (60.96mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.900" (22.86mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.31°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential in electronic components in order to ensure that the device functions as intended. Heat sinks are designed to transfer heat away from the component, thus maintaining the component temperature within optimal operating parameters. ATS-18F-42-C2-R0 is an advanced aluminum heat sink which is suitable for many general-purpose thermal applications.
Overview of ATS-18F-42-C2-R0:
The ATS-18F-42-C2-R0 is a highly efficient and cost-effective aluminum heat sink. It features a unique finned design that allows it to efficiently dissipate the heat generated by electronic components. The heat sink is made form high-grade aluminum for durability and long life. It also has a low profile design to ensure minimal interference with adjacent components in multi-layer installations. The ATS-18F-42-C2-R0 is compatible with various mounting systems, making it a versatile solution for different thermal management applications.
Application Fields of ATS-18F-42-C2-R0:
The ATS-18F-42-C2-R0 aluminum heat sink has a wide variety of applications in electronics cooling. It is particularly suitable for use in components that need to be cooled in high-power applications, such as high-performance gaming consoles, servers, and other industrial electronics. It is also recommended for use in passive cooling applications, such as CPU and GPU processors, power amplifiers, and audio speakers. Furthermore, it is an ideal choice for LED lighting, lithium-ion batterypacks, and automotive electronics.
Working Principle of ATS-18F-42-C2-R0:
The ATS-18F-42-C2-R0 aluminum heat sink employs a finned design to disperse heat to the surrounding air. The fins act as conductors and transfer heat away from the component via conduction. The finned design also increases the surface area available for the heat sink to dissipate heat. The heat is then dissipated to the surrounding environment via convection. The low profile design of the ATS-18F-42-C2-R0 ensures minimum interference with other components in multi-layer installations.
In addition, the ATS-18F-42-C2-R0 features a special mounting system which is suitable for various types of components. The mounting system allows the heat sink to be securely attached to the device with minimal thermal loss, ensuring optimal heat transfer efficiency. Its durable construction also makes it suitable for long-term installations in harsh environment.
Conclusion:
In conclusion, the ATS-18F-42-C2-R0 aluminum heat sink is an ideal solution for various thermal applications. Its finned design allows it to effectively transfer heat away from the component, while its low-profile and mounting system ensure minimal interference in multi-layer installations. It is suitable for use in high-power applications, passive cooling, LED lighting, and automotive electronics.
The specific data is subject to PDF, and the above content is for reference