| Allicdata Part #: | ATS30706-ND |
| Manufacturer Part#: |
ATS-18F-49-C2-R0 |
| Price: | $ 3.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X10MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18F-49-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.32010 |
| 10 +: | $ 3.23379 |
| 25 +: | $ 3.14622 |
| 50 +: | $ 2.97133 |
| 100 +: | $ 2.79657 |
| 250 +: | $ 2.62181 |
| 500 +: | $ 2.53441 |
| 1000 +: | $ 2.27223 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 26.36°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices used to dissipate heat away from components and circuits. The complexity of the application of heat sinks varies, depending on the thermal requirements of the components and systems to be cooled, as well as the environmental conditions and constraints of the application.
The ATS-18F-49-C2-R0 heat sink is designed to be a cost-effective solution for heat dissipation of a variety of components and systems. It provides superior thermal transfer capabilities when used in a variety of automotive, industrial, medical, and consumer applications.
The ATS-18F-49-C2-R0 heat sink uses a unique combination of material and design to ensure excellent thermal transfer efficiency. Its extruded aluminum fins are designed for maximum heat dissipation. The surface area of the fins is increased for improved heat dissipation. The fin shape decreases airflow resistance, allowing for greater air movement, resulting in improved thermal performance. The unique design of the fins eliminates air pockets, further improving thermal transfer capabilities. The ATS-18F-49-C2-R0 also utilizes micro-channel technology, which utilizes a continuous flow of air to achieve better heat exchange.
The ATS-18F-49-C2-R0 is designed with a robust construction, ensuring long-term use. The heat sink is designed to - meet and exceed industry standards, and is capable of operating at temperatures up to 200°C. The robust design allows the ATS-18F-49-C2-R0 to be used in a wide variety of demanding applications.
The ATS-18F-49-C2-R0 also has a variety of mounting options available. The heat sink can be used with common threading or pressure-sensing clips for mounting in a variety of locations. Additionally, the heat sink can be mounted to other components, such as PCBs, to achieve a variety of configurations and mounting possibilities.
The ATS-18F-49-C2-R0 is a cost-effective solution for dissipating heat. It offers superior thermal transfer capabilities and is designed with a variety of mounting options to fit a variety of applications and environments. With its robust design and excellent thermal performance, the ATS-18F-49-C2-R0 is an ideal solution for thermal management.
The specific data is subject to PDF, and the above content is for reference