| Allicdata Part #: | ATS-18F-60-C3-R0-ND |
| Manufacturer Part#: |
ATS-18F-60-C3-R0 |
| Price: | $ 4.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18F-60-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.95577 |
| 30 +: | $ 3.73611 |
| 50 +: | $ 3.51628 |
| 100 +: | $ 3.29654 |
| 250 +: | $ 3.07677 |
| 500 +: | $ 2.85700 |
| 1000 +: | $ 2.80206 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.50°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal Management is an essential factor for many applications and devices. With the rapid advances in technology, thermal management products such as heatsinks are becoming increasingly important in a wide range of applications. ATS-18F-60-C3-R0 is a versatile heat sink that has a wide range of applications in many different industries.
The ATS-18F-60-C3-R0 heatsink is an excellent choice for applications that require a passively cooled solution. It utilizes an array of cooling fins and grooves that help to dissipate heat rapidly. The heat-sink is also designed to provide an optimal balance between weight, size, and performance. It features an efficient design that ensures high thermal performance even under heavy workloads. Furthermore, the heatsink is constructed of high-grade aluminum and features excellent thermal conductivity, allowing it to dissipate heat efficiently.
The ATS-18F-60-C3-R0 can be used in a wide range of applications, including automotive, industrial, and consumer electronics. In automotive applications, it can be used to cool engines, transmission systems, and other components. In industrial applications, it can be used to cool components in high-stress and high-temperature environments. In consumer electronics, it can be used to cool processors, graphics cards, hard drives, and other components.
The ATS-18F-60-C3-R0 is also designed to provide maximum compatibility with a wide range of motherboards and other components. This heatsink features multiple mounting options, making it easy to install in different configurations. In addition, the heatsink also features an adjustable clip that helps secure the heatsink in place.
The ATS-18F-60-C3-R0 operates on a range of principles. Firstly, it features the process of free convection. This occurs when a fluid such as air, which is heated at the point of contact with a conductor, rises up due to the difference in its density between the hot and cooler air. Secondly, it also utilizes forced convection; this occurs when air or another coolant is forced over the heatsink to increase heat transfer. Finally, the ATS-18F-60-C3-R0 features the process of radiation. This occurs when the radiation given off by a heated object is absorbed by the cooler air surrounding it.
The ATS-18F-60-C3-R0 offers excellent performance and thermal management for many applications. It can be used in automotive, industrial, and consumer electronics applications, as well as many other applications where a reliable and efficient heat sink is required. With its efficient design, lightweight construction, and multiple mounting options, the ATS-18F-60-C3-R0 is an excellent choice for a wide range of thermal management needs.
The specific data is subject to PDF, and the above content is for reference