| Allicdata Part #: | ATS-18F-63-C1-R0-ND |
| Manufacturer Part#: |
ATS-18F-63-C1-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18F-63-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.37617 |
| 30 +: | $ 3.28503 |
| 50 +: | $ 3.10250 |
| 100 +: | $ 2.91999 |
| 250 +: | $ 2.73748 |
| 500 +: | $ 2.64622 |
| 1000 +: | $ 2.37248 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal Heat Sinks are components or devices that are used to dissipate heat from an electronic component or device. The ATS-18F-63-C1-R0 Heat Sink is a good example of such a device. It is typically used to help cool down high-power electronic components, such as CPUs or GPUs, as well as other heat-sensitive devices. This type of heat sink is composed of aluminum fins embedded in a dielectric frame. The device is designed to capture heat produced by the component and transfer it away from the source using the fins and frame.
The ATS-18F-63-C1-R0 Heat Sink is primarily used in the field of computer and IT applications. Since it is designed to handle high-power components, it is ideal for use in gaming PCs, workstations, and other large-scale operations which require a lot of processing power. It is also used in many applications that rely on high-performance, such as robotics, medical fields, and aerospace applications. Additionally, it is used in many consumer electronics, such as smartphones, tablets, and televisions, where heat dissipation is important.
The ATS-18F-63-C1-R0 Heat Sink is designed to work using the principle of Thermodynamics. Thermodynamics is the branch of science that deals with the transfer of heat energy between bodies across space and time. In this process, heat is transferred from the component to the heat sink, which then dissipates it into the air. This process is accomplished through convection, radiation, and conduction.
In convection, heat is transferred from the component to the heat sink through the circulating airflow. In radiation, heat is transferred from the component to the surrounding air using heat radiation. In conduction, heat is transferred through contact, such as when the component is in contact with the heat sink. The heat is then dissipated through the heat sink’s fins and frame.
The ATS-18F-63-C1-R0 Heat Sink is highly reliable and efficient in its performance. It can easily and quickly transfer heat away from components and devices that produce large amounts of heat. It is also relatively lightweight and compact, which makes it easy to install and maintain. Lastly, it is an affordable option for dissipating heat in many applications.
The specific data is subject to PDF, and the above content is for reference