| Allicdata Part #: | ATS-18F-65-C3-R0-ND |
| Manufacturer Part#: |
ATS-18F-65-C3-R0 |
| Price: | $ 4.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18F-65-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.15233 |
| 30 +: | $ 3.92175 |
| 50 +: | $ 3.69104 |
| 100 +: | $ 3.46040 |
| 250 +: | $ 3.22971 |
| 500 +: | $ 2.99902 |
| 1000 +: | $ 2.94134 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.40°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical factor to consider when designing electronic devices. Heat generated by the components must be effectively dissipated in order to prevent damage to the components or the entire system. ATS-18F-65-C3-R0 is a type of heat sink, a device used to absorb heat from components and transfer it away from them, improving their performance and prolonging their service life.
The ATS-18F-65-C3-R0 is a low-profile yet powerful aluminum finned heat sink, designed to dissipate temperatures ranging from 115 to 300 degrees Celsius. Its fin design allows for large contact area and high rate of thermal dissipation, along with maximum airflow better heat transfer performance. The heat sink also provides protection to adjacent components from direct contact and heat damage. The thermal conductive silicon gasket helps to transfer and absorbs heat from the component and effectively dissipates it to the surrounding atmosphere. The gasket is also designed to prevent transfer of moisture and other contaminants from reaching the component.
The ATS-18F-65-C3-R0 is designed to work with various types of electronic components, including CPUs, GPUs, and FPGAs. It has a low profile design, making it suitable for applications with limited space requirements. The four-pin attachment system ensures secure and easy mounting, while the two-piece clip also allows for additional components or devices to be mounted on the heat sink.
In order to ensure maximum thermal conductivity and heat dissipation, the heat sink should be connected to a properly sized cooling fan. The fan works in conjunction with the heat sink to blow air across the surface of the fins, helping to dissipate heat away from the components. The fan also provides a steady source of cooling air, allowing for the efficient dissipation of heat for higher performance components.
The ATS-18F-65-C3-R0 is a highly efficient and reliable heat sink that can be used in a variety of applications. It provides excellent thermal conductivity and heat dissipation, making it ideal for high performance components. It is also very easy to install and comes with a two-piece clip for mounting additional components. The compact design also allows it to be used in applications that have limited space requirements.
The specific data is subject to PDF, and the above content is for reference