| Allicdata Part #: | ATS-18F-77-C1-R0-ND |
| Manufacturer Part#: |
ATS-18F-77-C1-R0 |
| Price: | $ 3.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X30MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18F-77-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.31695 |
| 30 +: | $ 3.22707 |
| 50 +: | $ 3.04781 |
| 100 +: | $ 2.86858 |
| 250 +: | $ 2.68930 |
| 500 +: | $ 2.59965 |
| 1000 +: | $ 2.33071 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.24°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-18F-77-C1-R0 Thermal Heat Sink is a high quality heat sink designed for the thermal management of many different applications. It is designed to dissipate heat efficiently from components such as transistors, diodes and other electronic components. This thermal heat sink is constructed with aluminum alloy for superior strength and durability. The aluminum alloy material used provides excellent thermal performance and superior corrosion resistance. The heat sink design features an innovative natural convection design that helps ensure effective heat absorption.
The ATS-18F-77-C1-R0 has a large 37 x 77mm surface area that provides maximum heat dissipation and efficient thermal management. The fins on the heat sink are arranged in an optimum pattern that helps enhance the heat spreading capability. The design also features a number of integrated features such as screw mounting holes for easy installation, and a large mounting area for a variety of applications. The heat sink also has an integrated fan mounting system that helps to keep the thermal heat sink cool.
The ATS-18F-77-C1-R0 is suitable for use in a variety of applications. The high-efficiency design helps ensure that the components of the device maintain their optimal operating temperatures. This thermal heat sink is ideal for cooling integrated circuits, power converters, laser diode drivers, current regulators, and LEDs. This thermal heat sink also features the capability to be used in repetitive on-off switching systems. In addition, the ATS-18F-77-C1-R0 can also be used in thermal applications such as convection ovens, electric stoves, and convective thermal systems.
The ATS-18F-77-C1-R0 has a few working principles that help make it an effective thermal management solution. The first is the natural convection principle. The natural convection principle works by transferring thermal heat from the components of the device to the fins of the thermal heat sink. As the fins become warmer, they transfer more heat more easily to the air around the unit. This helps to dissipate more heat from the components, ensuring optimal performance.
The second working principle is the heat spreading capabilities. The heat spreading capability helps to spread the heat more evenly throughout the unit. By doing this, the thermal heat sink helps to keep components cool and dissipate more heat. The cooling capabilities are further enhanced by the integrated heat sink fan system, which helps to keep the heat from becoming localized at one spot on the unit.
The ATS-18F-77-C1-R0 Thermal Heat Sink is an effective solution for many types of thermal management applications. The innovative design allows for efficient distribution and absorption of heat, and the integrated fan system helps to keep components cool. In addition, the unit is designed to be easy to install and maintain, and the aluminum alloy construction ensures long-lasting durability. This thermal heat sink is capable of providing superior performance for applications such as integrated circuits, power converters, diode drivers, current regulators, and LEDs.
The specific data is subject to PDF, and the above content is for reference