ATS-18F-79-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	26.55°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks: ATS-18F-79-C3-R0 Application Field and Working Principle

Heat sinks are one of the most important components of a proper thermal management system. They absorb heat from the device or system being cooled, transferring the energy away from the object and into the environment. Heat sinks are used in a wide variety of applications, from cooling CPUs to dissipating excess heat from LED lights. Thermal management systems employ a variety of different thermal components to achieve their desired cooling performance, and ATS-18F-79-C3-R0 is one such heat sink.ATS-18F-79-C3-R0 is a type of two-piece skived heat sink, manufactured by Advanced Thermal Solutions. It is composed of two pieces of thermal-conductive aluminum, skived to minimal thickness, and then bonded together with a unique adhesive. This process makes the ATS-18F-79-C3-R0 one of the most efficient and lightweight heat sinks available on the market.The ATS-18F-79-C3-R0 is designed for use in electronic equipment and medical components, where size constraints require a low-profile heat sink. It has a fin type design, with overlapping fins creating a high-performance surface area that maximizes air flow around the heat sink. The larger flange provides better dissipation, while the compact size allows it to be installed in thinner electronic enclosures.The working principle of the ATS-18F-79-C3-R0 is based on the principles of thermodynamics. Heat from the device or component is absorbed by the heat sink, and the heat is then dissipated into the surrounding environment. Heat transfer is facilitated by ambient air, as well as by the thermal conductivity of the aluminum used in the heat sink.The ATS-18F-79-C3-R0 is an effective and efficient heat sink due to its lightweight, high-performance design. It is able to absorb large amounts of heat from the device or component it is cooling, while remaining small enough to be installed in tight spaces. The construction of the heat sink also ensures a long service life, as its two-piece skived design prevents thermal fatigue from constant use over time.In conclusion, the ATS-18F-79-C3-R0 is a high-performance two-piece skived heat sink designed for use in devices and components where size constraints restrict the available cooling solutions. Its finned design allows for maximum air flow around the heat sink, and its lightweight construction makes it suitable for even the tightest of spaces. The ATS-18F-79-C3-R0 is an effective thermal management solution, providing a reliable means to dissipate heat away from a device or component.

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