ATS-18G-10-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-18G-10-C3-R0-ND

Manufacturer Part#:

ATS-18G-10-C3-R0

Price: $ 3.93
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-18G-10-C3-R0 datasheetATS-18G-10-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.57399
30 +: $ 3.37554
50 +: $ 3.17696
100 +: $ 2.97845
250 +: $ 2.77989
500 +: $ 2.58133
1000 +: $ 2.53168
Stock 1000Can Ship Immediately
$ 3.93
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.99°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are essential components used in various industrial applications for effective heat dissipation. The ATS-18G-10-C3-R0 is a heat sink developed by Advanced Thermal Solutions (ATS) that provides efficient thermal management solutions for large and medium-sized electronic devices. In this article, we will discuss the application fields and working principles of this advanced thermal product.

Application Fields

The ATS-18G-10-C3-R0 is a superior quality heat sink designed to dissipate heat from large and medium-sized circuit boards. It features mounted within a frame and pin socket contact points for a secure fit into its respective circuit board. This makes it ideal for applications that require a larger heat sink for efficient cooling. It is particularly suited for servers, automotive control units, home electronics, and industrial automation systems where heat build-up can lead to component activation issues.

The ATS-18G-10-C3-R0 has an elongated, slotted heat sink design with an effective thermal conductivity of 18 W/m-K. This makes it capable of dissipating larger amounts of heat in shorter times. It has also been specially formulated to reduce operating vibration and noise. This means it can be safely used in electronic systems requiring low noise performance. Additionally, it meets the stringent RoHS environmental safety standards.

Working Principle

The ATS-18G-10-C3-R0 is designed to efficiently dissipate heat generated by electronic components. Heat is transferred from the internal components into the ambient environment through the heat sink via natural convection. The heat is then absorbed by the air in the room or surrounding environment and transported away from the heat sink.

The ATS-18G-10-C3-R0 features slotted fins and multiple pins for increased contact area. The pins help to increase the heat transfer surface area available. This, in turn, helps to dissipate heat more quickly and effectively. Additionally, the fins on the heat sink help to increase the surface area for heat dissipation by increasing the air flow around the heat sink.

The ATS-18G-10-C3-R0 heat sink is an advanced thermal management solution that has been designed to provide superior performance in large and medium-sized electronic applications. It is highly efficient, reliable and compatible with both low and high voltage devices. The slotted fins and larger contact area increase cooling efficiency, making it an ideal thermal management solution for a range of electronic systems.

The specific data is subject to PDF, and the above content is for reference

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