ATS-18G-11-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-18G-11-C3-R0-ND

Manufacturer Part#:

ATS-18G-11-C3-R0

Price: $ 3.83
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X10MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-18G-11-C3-R0 datasheetATS-18G-11-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.48138
30 +: $ 3.28818
50 +: $ 3.09481
100 +: $ 2.90134
250 +: $ 2.70791
500 +: $ 2.51449
1000 +: $ 2.46614
Stock 1000Can Ship Immediately
$ 3.83
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 18.86°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat SinksHeat sinks are devices used to dissipate heat in order to keep electrical and electronic components functioning properly. They are a crucial element for the successful operation of any electronic device. The ATS-18G-11-C3-R0 is a high-performance heat sink designed to provide efficient thermal management for various electrical and electronic applications.This heat sink is made of an aluminum body that offers excellent heat transfer. The thickness of the aluminum body ensures good heat dissipation from the heat source. The fin design of this heat sink is also optimized to achieve maximum heat transfer; the fin structure offers larger air contact area, which increases efficiency. The center-placed fan further enhances the heat dissipation capability of the heat sink.The ATS-18G-11-C3-R0 heat sink is designed to be used in a variety of applications. It can be used for cooling down CPUs, GPUs, power amplifiers, medical implants, and automotive applications. The heat sink is also suitable for use in areas where high power handling is required, such as high-current PCBs and high-power laser systems.The ATS-18G-11-C3-R0 heat sink is designed with a unique working principle; it uses the convection type of cooling mechanism. It works by allowing air to pass through heat conduction fins, which absorb the heat and then transfer it to the fins. The fins are designed so that the airflow is efficient, helping to dissipate the heat faster. The fan inside the heat sink further allows for efficient heat transfer.The ATS-18G-11-C3-R0 heat sink also comes with advanced features that make it an ideal choice for any thermal management application. It has a built-in over-temperature protection system to protect the components, and it also has advanced temperature controllers to ensure the heat is dissipated efficiently and safely.All these features make the ATS-18G-11-C3-R0 heat sink an ideal choice for any application that requires efficient thermal management. With its ability to dissipate heat quickly and its advanced features, the ATS-18G-11-C3-R0 heat sink is an excellent choice for any thermal management application.

The specific data is subject to PDF, and the above content is for reference

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