ATS-18G-111-C1-R1

Thermal - Heat Sinks are key components in a wide variety of technologies and applications. From computers to electronics, from medical to industrial, they play an essential role in ensuring that things stay cool and safe.

The ATS-18G-111-C1-R1 is a custom thermal solution designed to dissipate heat from high-power electronics. This component can be used in numerous electrical and electronic applications, including computers, servers, and embedded systems. The ATS-18G-111-C1-R1 has been engineered to serve a broad range of industries, including automotive, medical, audio/visual, security, telecommunications, and industrial.

The basic principle of thermal management, as implemented in this component, is to transfer and dissipate the heat generated from the component\'s power source. In this way, the component can maintain its temperature, avoid overloads, and prevent the occurrence of any potential fire hazards.

The ATS-18G-111-C1-R1 features an aluminum-alloy construction as well as a base and panel that are both pre-drilled for mounting. It also has a recessed base for easier installation and ventilation. The base is made from a temperature-resistant material to ensure that it can dissipate heat more efficiently over a broad range of temperatures. The panel is also made from a flame-retardant material to help protect the component from any potential fire hazards.

The core technology of the ATS-18G-111-C1-R1 consists of its patented DualHeat technology. This technology utilizes a combination of convection, conduction, and radiation to dissipate heat efficiently. It draws hot air away from the component and dissipates it outwards into the ambient air. The design also features passes and fins that increase the surface area for heat dissipation. The result is a much higher level of heat dissipation efficiency compared to traditional heat sinks.

The ATS-18G-111-C1-R1 is a highly customizable thermal solution. It is available in several different sizes and can also be customized with different heating elements to meet the needs of each application. The component is also designed to be compatible with a wide range of other thermal solutions, such as cooled water systems and forced air solutions. This ensures that it can be easily integrated into any system and specifications.

In conclusion, the ATS-18G-111-C1-R1 is a highly reliable and efficient thermal solution designed to dissipate heat from high-power electronics. Its DualHeat technology ensures reliable performance and excellent heat dissipation efficiency. It is also highly customizable and is compatible with a wide range of other thermal solutions.