| Allicdata Part #: | ATS-18G-117-C1-R0-ND |
| Manufacturer Part#: |
ATS-18G-117-C1-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18G-117-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78208 |
| 30 +: | $ 2.70669 |
| 50 +: | $ 2.55629 |
| 100 +: | $ 2.40591 |
| 250 +: | $ 2.25553 |
| 500 +: | $ 2.18034 |
| 1000 +: | $ 1.95479 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-18G-117-C1-R0 heat sink is a prime example of the advanced thermal management solutions available for controlling thermal power in a range of applications. It has several features which make it a suitable choice for a range of applications, including high power and rapid thermal conductivity.
The ATS-18G-117-C1-R0 has an anodized aluminum flange and copper slug base. The flange provides maximum heat radiation, and the copper slug base provides excellent thermal conductivity. This ensures that the heat generated from the systems’ components is quickly dissipated as soon as it is produced. The heat sink also has an ergonomic and efficient design that allows it to fit a variety of cooling systems.
The ATS-18G-117-C1-R0 has a high flow rate of heat that is generated from the system’s components. This allows the heat to dissipate quickly and efficiently from the system’s circuit boards. As a result, the temperature of the boards is reduced. This helps prevent the circuit boards from overheating, which can lead to significant damage to the components.
The ATS-18G-117-C1-R0 has several features which make it a suitable solution for a range of applications. These features include its ability to maintain a constant temperature in order to ensure that the components within a system operate at the optimum temperature, as well as its ability to dissipate heat quickly and efficiently. Its design also provides an optimal amount of air circulation, which further helps to reduce the amount of heat emitted.
The ATS-18G-117-C1-R0 is designed to work in applications where high power and rapid thermal conductivity are key requirements. It is particularly suited to applications such as computer servers, power supplies, industrial equipment, and telecommunications systems. Due to its excellent thermal conductivity, it can be used in applications that require power and temperature management, such as LED lighting and HVAC systems.
The ATS-18G-117-C1-R0 is designed to work with thermal management principles. Thermal management principles are based on the laws of thermodynamics and are used to manage the temperature of a system. These principles allow the system to operate at the optimal temperature while dissipating heat quickly and efficiently.
The ATS-18G-117-C1-R0 has a number of features which make it a suitable solution for a range of thermal management applications. Its high-performance features include its high-power and rapid thermal conductivity, floating installation design, and air circulation optimization. These features ensure that the heat generated by the system is quickly and efficiently dissipated. In addition, its ergonomic design allows it to fit into a range of cooling systems, making it a suitable choice for a range of applications.
In conclusion, the ATS-18G-117-C1-R0 heat sink is a prime example of the advanced thermal management solutions available. It is particularly suitable for applications that require a high power and rapid thermal conductivity, and works with thermal management principles to manage the temperature of a system. Its ergonomic design allows it to fit a variety of cooling systems, ensuring that it is a suitable choice for a range of applications.
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