| Allicdata Part #: | ATS-18G-143-C1-R0-ND |
| Manufacturer Part#: |
ATS-18G-143-C1-R0 |
| Price: | $ 3.42 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18G-143-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.11472 |
| 30 +: | $ 3.03051 |
| 50 +: | $ 2.86209 |
| 100 +: | $ 2.69375 |
| 250 +: | $ 2.52542 |
| 500 +: | $ 2.44124 |
| 1000 +: | $ 2.18870 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.28°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-18G-143-C1-R0 is part of the range of Thermal - Heat Sinks that serve a range of applications where thermal management is required. Thermal management is the process of controlling and managing temperatures in order to maximize the efficiency of components in an electronic system. Heat sink design plays an important role in this. This particular product is suitable for applications as diverse as PCs, laptops, home appliances, medical equipment, networking, telecommunications, automotive, military and aerospace.
Essentially, the ATS-18G-143-C1-R0 acts as a method of transferring heat away from a component and dissipating it into the air. It does this by providing a large surface area across which the heat can be conducted away. This heat is then convected to the air by a fan or natural convection, and then radiated into the environment. In order for a heat sink to be successful, its shape and size must correspond to that of the component whose heat needs to be dissipated, and the type of convection must also be appropriate for the required application. This product does just that.
The ATS-18G-143-C1-R0 is designed with an airflow optimization profile, maximizing its cooling performance. This profile also reduces windage and leakage losses. This heat sink has an optimal combination of low thermal resistance and total weight. It consists of an array of flat-fins formed from aluminum, copper or high reflecting ceramic substrates. The fins are slotted into an efficient design, ensuring good surface-contact against the components.
The ATS-18G-143-C1-R0 comes with an array of customizable options, including fin base height and fin density for fine-tuning the performance. It also has a variety of mounting options, allowing for application in almost any setting. Furthermore, the choice of material and coatings allows for corrosion resistance and other environmental considerations.
The ATS-18G-143-C1-R0 is designed to offer a low cost alternative to more traditional methods of thermal management. In addition, its adjustable and versatile design makes it suitable for a number of different applications. Its wide range of options and benefits make the ATS-18G-143-C1-R0 an ideal choice for thermal management.
The specific data is subject to PDF, and the above content is for reference