ATS-18G-170-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-18G-170-C1-R0-ND

Manufacturer Part#:

ATS-18G-170-C1-R0

Price: $ 3.35
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X15MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-18G-170-C1-R0 datasheetATS-18G-170-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.04353
30 +: $ 2.96100
50 +: $ 2.79657
100 +: $ 2.63208
250 +: $ 2.46758
500 +: $ 2.38533
1000 +: $ 2.13857
Stock 1000Can Ship Immediately
$ 3.35
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 10.02°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

ATS-18G-170-C1-R0 Application Field and Working Principle

ATS-18G-170-C1-R0 is a type of thermal-heat sinks which is designed to provide effective cooling of electrical and electronic components. It is widely used in many industries, including medical, industrial, automotive, and aerospace. The ATS-18G-170-C1-R0 is a two-stage system, which means that it consists of two separate modules. The first module is the primary heat sink, which is designed to dissipate heat from electronic components, and the second module is the secondary heat sink, which is designed to dissipate heat from the primary heat sink.

The ATS-18G-170-C1-R0 has been designed to provide optimal performance and efficiency in any application, making it suitable for a variety of industrial and commercial applications. Its high efficiency thermal conductivity ensures that heat is quickly and evenly dissipated, reducing the overall temperature of electronic devices. This product also offers superior thermal stability, meaning that it will maintain a consistent temperature within its operating range, even under varying temperatures or operating conditions.

The two-stage system of the ATS-18G-170-C1-R0 offers a number of advantages over traditional single-stage cooling systems. The primary heat sink is able to absorb a larger amount of heat energy than a single-stage system, and the secondary heat sink is able to dissipate this heat energy away from the components more quickly and evenly. This leads to more efficient cooling and improved system reliability. Additionally, because the primary and secondary modules are separate, it is easier to maintain and service the system.

The ATS-18G-170-C1-R0 is designed to create a natural airflow around the heat sink, allowing it to dissipate heat more efficiently. The unique shape of this product also ensures that the airflow around the heat sink is even, making it suitable for wide-range applications. In addition, the product is designed to be easily installed and serviced, offering greater convenience for customers and businesses alike.

In conclusion, the ATS-18G-170-C1-R0 is an exceptionally efficient thermal-heat sink solution, providing superior performance in any application. It offers excellent thermal conductivity, greater thermal stability, and improved airflow, making it suitable for a wide range of applications. Moreover, the product is easy to install and service, making it a reliable and cost-effective solution for any industry, including medical, industrial, automotive, and aerospace.

The specific data is subject to PDF, and the above content is for reference

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