| Allicdata Part #: | ATS30844-ND |
| Manufacturer Part#: |
ATS-18G-170-C2-R0 |
| Price: | $ 3.84 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18G-170-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.49020 |
| 10 +: | $ 3.40011 |
| 25 +: | $ 3.30800 |
| 50 +: | $ 3.12430 |
| 100 +: | $ 2.94052 |
| 250 +: | $ 2.75675 |
| 500 +: | $ 2.66487 |
| 1000 +: | $ 2.38918 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical aspect of all electronic offerings, and heat sinks are among the most important components used to prevent overheating. The ATS-18G-170-C2-R0, a heat sink designed for advanced thermal management of high density electronic systems, provides a robust and reliable solution to the problem of heat dissipation in small and highly sensitive components.
The ATS-18G-170-C2-R0 utilizes an integrated solution of copper and aluminum to efficiently dissipate heat away from sensitive components. The thermal conduction of the copper core helps direct the heat away from the component, while the aluminum fins act as an additional dispersal method. Together, these components are instrumental to delivering superior thermal performance.
The ATS-18G-170-C2-R0 is extremely versatile and can be applied to a variety of electronic projects or applications. It is designed to efficiently dissipate heat from high-density integrated circuits, microprocessors, power supplies, and other advanced applications. It is also capable of continuous operation at temperatures of up to 200°C and can even operate in harsh conditions that include high shock and vibration. In addition, its robust design and superior thermal performance make it suitable for a wide range of applications, including those in the telecom, server, and embedded systems markets.
The ATS-18G-170-C2-R0\'s advanced design and versatile applications make it one of the most popular products in its class. It provides a reliable solution to the challenge of dissipating heat from high-density components while simultaneously providing superior thermal performance. This allows designers and engineers to create innovative products that can withstand high temperature and demanding conditions.
In addition to its superior thermal conduction, the ATS-18G-170-C2-R0 features an innovative design that allows for fast and easy installation. It has been designed to be compatible with most thermal interfaces, making it compatible with a wide range of applications. Additionally, the unit\'s innovative design also acts as a deterrent to lateral motion, reducing the risk of component damage and ensuring optimum performance.
The ATS-18G-170-C2-R0\'s robust construction and superior thermal performance make it one of the most trusted heat sink products on the market. Its versatility, easy installation, and safe operation make it the ideal solution for all thermal management needs.
The specific data is subject to PDF, and the above content is for reference