ATS-18G-189-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-18G-189-C1-R0-ND

Manufacturer Part#:

ATS-18G-189-C1-R0

Price: $ 3.75
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X20MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-18G-189-C1-R0 datasheetATS-18G-189-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.41208
30 +: $ 3.31968
50 +: $ 3.13526
100 +: $ 2.95079
250 +: $ 2.76641
500 +: $ 2.67419
1000 +: $ 2.39754
Stock 1000Can Ship Immediately
$ 3.75
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.72°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are a very important part of any hardware component. A heat sink is a device, typically aluminum or copper, that dissipates heat from a component or system, using thermal conductivity and conduction. The ATS-18G-189-C1-R0 is one such heat sink that is designed to disperse heat from electronic components, while maintaining long term durability and low thermal resistance.

The ATS-18G-189-C1-R0 is primarily made of aluminum and uses all sensible cooling techniques to ensure optimal performance. This device features an air-exchange cavity that is designed to enable maximum air circulation. The ATS-18G-189-C1-R0 also has a series of fins which provide additional heat dissipation. Each fin is coated with a special material to increase its surface area and enhance the thermal performance. Lastly, this heat sink has a robust mounting system that ensures a stable connection between the component and the device.

The ATS-18G-189-C1-R0 heat sink is widely used in a range of applications. It is most commonly used in the automotive industry, where it is used to cool components in vehicles. It is also used in medical and aerospace industries, as well as gaming consoles, computers and other consumer electronic products. The ATS-18G-189-C1-R0 is also used for thermal management solutions in industrial services, particularly in applications with extreme environmental conditions, such as high temperature, vibration, dust, and moisture.

The ATS-18G-189-C1-R0 heat sink is also designed to function in harsh environments and has an operating temperature range of -55°C to +150°C. This thermal management device will provide reliable performance and efficient heat dissipation even in extreme conditions. In addition, the device also offers excellent corrosion and oxidation resistance.

The ATS-18G-189-C1-R0\'s working principle is based on the simple three-layer structure, where two dissimilar materials, aluminum and a cooling material, are placed together. The combination of the two materials enables the device to effectively transfer heat to the external environment, while at the same time providing protection from environmental elements.

The ATS-18G-189-C1-R0 heat sink is designed to dissipate heat from a component quickly and efficiently. This device offers long-term, superior performance and durability, while providing excellent thermal management solutions for various applications. Because of its features and high efficiency, the ATS-18G-189-C1-R0 heat sink is widely used in automotive, medical, aerospace and consumer electronic products, offering reliable performance and safe operation even in harsh environments.

The specific data is subject to PDF, and the above content is for reference

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