| Allicdata Part #: | ATS-18G-23-C3-R0-ND |
| Manufacturer Part#: |
ATS-18G-23-C3-R0 |
| Price: | $ 5.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X15MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18G-23-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.60341 |
| 30 +: | $ 4.34784 |
| 50 +: | $ 4.09210 |
| 100 +: | $ 3.83632 |
| 250 +: | $ 3.58057 |
| 500 +: | $ 3.32481 |
| 1000 +: | $ 3.26087 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.06°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-18G-23-C3-R0 is a high performance thermal heat sink used in a wide variety of applications. It is designed to effectively dissipate heat from critical components while providing superior performance and reliability. The ATS-18G-23-C3-R0 is made of durable aluminum and utilizes a patented heat pipe technology to increase thermal conductivity, reduce temperature, and minimize component temperatures.
The ATS-18G-23-C3-R0 application field includes areas such as power supplies, electronic systems, automotive, medical, solar power systems, industrial systems, and embedded applications. It is used in applications that require heat sinks to maintain high performance in areas with extreme temperature variance. The ATS-18G-23-C3-R0 is also used in the consumer electronics market, where it provides excellent efficiency in cooling electronics like graphic cards, CPUs, and microprocessors.
The ATS-18G-23-C3-R0 is designed to provide superior thermal performance and stability. It is a combination of a fabrication process that maximizes heat transfer and an engineered design that facilitates air flow. The heat sink uses a patented heat pipe technology that increases thermal conductivity and heat displacement, allowing more effective temperature maintenance and higher thermal efficiency.
The ATS-18G-23-C3-R0 integrates a three-dimensional patterned fin structure into the heat sink to improve heat transfer. This design also maximizes the effectiveness of the fan size and air flow rate. The fins are specifically tailored to the thermal requirements of the application, improving the performance and efficiency of the heat sink. The fins also work in tandem with the heat pipe technology to further improve the heat transfer and thermal efficiency of the ATS-18G-23-C3-R0.
The ATS-18G-23-C3-R0 is an efficient and effective thermal heat sink that can be used in a wide variety of applications. Its patented heat pipe technology, three-dimensional fin structure, and tailored thermal requirements ensure that it provides superior performance and reliability. The ATS-18G-23-C3-R0 is an ideal choice for applications that require high thermal performance in extreme environments. It can be used to keep electronic components cool and reduce the temperature in critical areas, increasing the lifespan and overall performance of the components.
The specific data is subject to PDF, and the above content is for reference