| Allicdata Part #: | ATS-18G-39-C1-R0-ND |
| Manufacturer Part#: |
ATS-18G-39-C1-R0 |
| Price: | $ 5.49 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X60.96X5.84MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18G-39-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.93920 |
| 30 +: | $ 4.66473 |
| 50 +: | $ 4.39022 |
| 100 +: | $ 4.11585 |
| 250 +: | $ 3.84146 |
| 500 +: | $ 3.56707 |
| 1000 +: | $ 3.49848 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 2.400" (60.96mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.230" (5.84mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal – Heat Sinks are an essential part of the commercial and industrial sectors particularly in any environment where cooling systems are essential. They are considered to be one of the most popular heat-exchange systems ever developed. The ATS-18G-39-C1-R0 is a heat sink designed for specific applications and working principles.
A heat sink is an effective way to dissipate thermal energy away from a given component or material. The ATS-18G-39-C1-R0 is a widefin heat sink that utilizes air as the primary cooling medium. It is designed for use in harsh environments and is capable of working under extremely high temperatures – up to 500 degrees Celsius. The heat sink can also be configured to meet a variety of cooling requirements.
The heat sink consists of a base plate and fin array. The fins are of varied height and thickness to ensure optimal heat dissipation. The fins are also designed to create turbulent air flow, which improves the heat transfer rate. The base plate conducts heat to the fins allowing for efficient heat dissipation.
The ATS-18G-39-C1-R0 heat sink is typically used in high powered electronic components and systems. It is most commonly used in power electronics, such as transistors and mosfets, where the heat dissipation is of utmost importance. As the power levels of the components increase, so does the need for more efficient cooling solutions. This is where the ATS-18G-39-C1-R0 heat sink comes in.
The heat sink utilizes natural convection as the main method of heat dissipation. Natural convection occurs when a hot object is placed into a cooler environment. As the heat is radiated away from the heat sink, it rises and is replaced by cooler air. This process helps to reduce the temperature of the heat sink. In addition to natural convection, the heat sink also utilizes forced convection, which involves fans to push cool air onto the heat sink.
The ATS-18G-39-C1-R0 heat sink is an efficient cooling solution for high powered electronic components. It offers an optimal thermal management solution that can help reduce system downtime and increase productivity. It can also be used in many other industries such as military, aerospace, and automotive. Moreover, it is easy to install and configure and is manufactured from durable materials, making it an ideal choice for applications where reliability and performance is key.
The specific data is subject to PDF, and the above content is for reference