| Allicdata Part #: | ATS-18G-58-C1-R0-ND |
| Manufacturer Part#: |
ATS-18G-58-C1-R0 |
| Price: | $ 3.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18G-58-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.23379 |
| 30 +: | $ 3.14622 |
| 50 +: | $ 2.97133 |
| 100 +: | $ 2.79657 |
| 250 +: | $ 2.62181 |
| 500 +: | $ 2.53441 |
| 1000 +: | $ 2.27223 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management components such as heat sinks are essential to the operation of various electronic devices. The ATS-18G-58-C1-R0 heat sink is one such product. This component is designed to dissipate heat energy from devices by transferring it to the surrounding air. It does this through a process called convection, which is the transfer of heat energy through the movement of air or fluid.
The ATS-18G-58-C1-R0 is an ideal choice for applications where heat needs to be released quickly and efficiently. This heat sink is designed with a flat-pin extruded base using lightweight 609 grade aluminum alloy. Optional covers made of silicone and a thermal interface material are also available. The total weight of the heat sink is just 0.2 pounds, making it easy to integrate into a wide variety of applications.
The ATS-18G-58-C1-R0 is also relatively easy to install. All that is required is that it be attached to the device that needs to be cooled and plugged into the device’s power supply. It is designed to provide excellent cooling performance even under conditions of high airflow. Its wide base also ensures adequate heat dissipation, making it suitable for applications where the ambient temperature is high or in enclosed spaces.
When it comes to the thermal characteristics of the ATS-18G-58-C1-R0, it features a thermal performance of 3 Watts/cm2. The thermal resistance of this heat sink is 0.51°C/W. It also has a thermal design power of 6W, which is more than adequate for many applications. The heat sink also has a large exposed surface area for maximum heat dissipation.
In terms of design, the ATS-18G-58-C1-R0 features a unique pin fin configuration that is designed to capture more air and provide a continuous convection of heat. This heat sink also utilizes an internal copper core for higher thermal efficiency. Its pin layout is designed to minimize air flow impedance, which improves the cooling performance of the device it is attached to.
Overall, the ATS-18G-58-C1-R0 heat sink is an excellent choice for many applications due to its superior cooling performance and low cost. Its pin fin design is optimized for low air flow impedance and the aluminum alloy construction offers robustness and excellent mechanical strength. The flat-pin extruded base and wide base ensure maximum heat dissipation. Finally, the heat sink is lightweight at just 0.2 pounds which makes it easy to install.
The specific data is subject to PDF, and the above content is for reference