| Allicdata Part #: | ATS-18G-61-C3-R0-ND |
| Manufacturer Part#: |
ATS-18G-61-C3-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18G-61-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.23358 |
| 50 +: | $ 3.04340 |
| 100 +: | $ 2.85314 |
| 250 +: | $ 2.66293 |
| 500 +: | $ 2.47272 |
| 1000 +: | $ 2.42517 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 22.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
.Thermal management plays a vital role in the reliability and performance of electronic systems. Heat sinks are a key component in the thermal management of such systems. The ATS-18G-61-C3-R0 is a type of heat sink specifically designed for use in a variety of electronic systems.
The ATS-18G-61-C3-R0 was designed for applications where high power density and low-profile components are needed. With its slim profile, low standoff temperature and lightweight design, this heat sink is suitable for use in a range of devices including high-power CPUs, GPUs, FPGAs, ASICs, and logic ICs. This heat sink also features an optimized mounting system which allows for easier installation and highly reliable operation.
The ATS-18G-61-C3-R0 utilizes a variety of technologies and components to ensure efficient thermal management of electronic components. The core of the heat sink consists of a base plate made of 6063-T6 aluminum alloy, along with fins made of extruded aluminum. The fin design ensures that air can rapidly pass through the heat sink, and also features a specialized coating to reduce air flow losses. This design ensures that maximum cooling is achieved with a minimum of space.
The thermal performance of the ATS-18G-61-C3-R0 is further enhanced through the use of an embedded copper heat transfer layer. The copper layer has a fins spacing of 0.8mm, and is attached to the fins via soldering. This layer is responsible for rapidly absorbing heat generated by the components before it is dissipated into the ambient air by the aluminum fins.
In addition to the heat transfer layer, the ATS-18G-61-C3-R0 also features two latching mechanisms which ensure secure and easy installation of the heat sink and its components. The first latch is a spring pin-shaped latch which is used to secure the heat sink to the component, while the second is a snap-ring latch which is used to secure the fins to the mounting plate.
The combination of these features, along with its low-profile design and light weight, makes the ATS-18G-61-C3-R0 an ideal heat sink for a variety of heat-sensitive applications. It\'s ability to handle high power density and low-profile components make it suitable for use in a vast range of devices. The embedded copper heat transfer layer and the latching mechanisms make this heat sink highly reliable and also improve its overall thermal performance.
The specific data is subject to PDF, and the above content is for reference