ATS-18G-65-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-18G-65-C1-R0-ND

Manufacturer Part#:

ATS-18G-65-C1-R0

Price: $ 4.02
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X30MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-18G-65-C1-R0 datasheetATS-18G-65-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.65526
30 +: $ 3.45198
50 +: $ 3.24904
100 +: $ 3.04592
250 +: $ 2.84286
500 +: $ 2.63980
1000 +: $ 2.58903
Stock 1000Can Ship Immediately
$ 4.02
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.181" (30.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.27°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-18G-65-C1-R0 is a type of thermal - heat sink used in a variety of applications. Heat sinks are designed to dissipate heat from an area, allowing the contents to remain as cool as possible. Heat sinks are an integral part of many electronic devices as well as various industrial processes.The ATS-18G-65-C1-R0 heat sink is constructed from aluminum and has a copper base for heat conductivity. It features four straight-finned cooling fins that allow air to flow through in order to dissipate heat away from the area. The ATS-18G-65-C1-R0 also has an integral fan to assist in cooling. The fan operates on 12 volts at 0.08 amps, and can be mounted to the side of the heat sink.The ATS-18G-65-C1-R0 has an efficient design that helps it to facilitate an efficient flow of air through the heat sink, allowing it to dissipate heat more effectively. The heat sink also has a black anodized finish which makes it resistant to corrosion.The ATS-18G-65-C1-R0 can be used in a variety of applications such as: computers, consumer electronics, telecommunications, and other electronics-related applications that need to be kept cool. It can also be used in industrial applications such as: high-pressure pumps, environmental enclosures, and atomizers.When using the heat sink, it is important to ensure that it is properly attached to a heat source in order for it to be effective. The ATS-18G-65-C1-R0 has a secure mounting system that uses a combination of fasteners and adhesive to create a tight seal. It also has a thermal interface material that is designed to fill any gaps between the heat source and the heat sink. This will help to reduce any thermal loss that may occur.The ATS-18G-65-C1-R0 also has a range of features that help to make it an effective cooling device. It has a low profile design that allows it to fit into smaller spaces and a high-performance design that makes it easier to dissipate heat at a higher level. The ATS-18G-65-C1-R0 also offers superior thermal conductivity, meaning that it can dissipate heat quicker than other heat sinks of similar sizes.The ATS-18G-65-C1-R0 heat sink is designed to work with the principles of thermodynamics, which states that heat will flow from an area with high temperatures to one with low temperatures. In this case, the heat sink acts as a cooling area, allowing air to flow around its fins and dissipate the heat away from the area. The air then moves along the fins of the heat sink and is eventually released to the environment, helping to keep the interior cool.In conclusion, the ATS-18G-65-C1-R0 is a thermal - heat sink that has been designed to dissipate heat in a range of applications. It features a secure mounting system, a high-performance design, and a range of other features that make it an effective choice for dissipating heat. Its high-performance design also makes it an effective choice for cooling consumer electronics, telecommunications, and any other electronics-related applications that require cooling.

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