ATS-18G-90-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-18G-90-C1-R0-ND

Manufacturer Part#:

ATS-18G-90-C1-R0

Price: $ 3.94
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X35MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-18G-90-C1-R0 datasheetATS-18G-90-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.58596
30 +: $ 3.38646
50 +: $ 3.18730
100 +: $ 2.98809
250 +: $ 2.78888
500 +: $ 2.58968
1000 +: $ 2.53987
Stock 1000Can Ship Immediately
$ 3.94
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 6.33°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are necessary for controlling the temperature in many electronic applications, whereby heat generated by electronic components needs to be dissipated by a suitable heat-dissipation material such as aluminum or copper. In this context, ATS-18G-90-C1-R0 is a passive heat sink designed to dissipate heat generated by an electronic device, such as a microprocessor or specialist power regulator.

The ATS-18G-90-C1-R0 rises to the challenge by offering a breakthrough design that utilizes a combination of high-quality aluminum and extruded fins that enable efficient heat dissipation. What makes this model particularly effective is that the combination of geometric shapes and ventilation holes increase its surface area, allowing for an increased volume of air to move through the device and deliver the optimal rate of cooling. This design has proven to be extremely effective in dissipating large amounts of heat from the most advanced electronics, hence its growing popularity in the industry.

In operations, an ATS-18G-90-C1-R0 heat sink typically works in tandem with an active cooling system, such as a fan. This combination helps to improve cooling efficiency by dissipating heat directly from the heat source, whilst the fan further promotes the flow of air. This is often implemented in electronic systems that generate a high degree of heat, such as graphics cards or powerful processors.

When it comes to the actual installation of an ATS-18G-90-C1-R0 heat sink, it is important to consider the correct orientation of the sink to ensure that it is in line with the direction of any cooling flow. Professional installation is also highly recommended to maximize the effectiveness of the device, as correct positioning and spacing of the sink can drastically improve performance.

In summary, the ATS-18G-90-C1-R0 is an efficient and cost-effective way to dissipate excess heat from electronics. Its lightweight construction and innovative design allow for efficient cooling, even in high-intensity applications. When installed correctly, the device can be relied upon for long-term performance, making it a perfect choice for many of today’s most advanced electronics.

The specific data is subject to PDF, and the above content is for reference

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