| Allicdata Part #: | ATS30959-ND |
| Manufacturer Part#: |
ATS-18H-05-C2-R0 |
| Price: | $ 3.95 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18H-05-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.59100 |
| 10 +: | $ 3.49524 |
| 25 +: | $ 3.40074 |
| 50 +: | $ 3.21174 |
| 100 +: | $ 3.02280 |
| 250 +: | $ 2.83387 |
| 500 +: | $ 2.73940 |
| 1000 +: | $ 2.45602 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.72°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are generally used to dissipate heat away from a component or device that has generated a large amount of heat. For device or component cooling, heat sinks are usually used in combination with fans or other air-moving devices. Heat sinks are manufactured using a variety of materials such as aluminum, copper, and steel. Accessories, such as thermal tape and thermally conductive grease, can assist in improving the performance of the heat sink.
The ATS-18H-05-C2-R0 is a popular thermal-heat sink that employs a unique fin design to more effectively dissipate heat away from an object. This heat sink is constructed of extruded aluminum which has been anodized for better heat transfer properties. It has a height of 18mm, a width of 35mm, and a length of 28mm. This type of heat sink features an integrated clip which securely locks it into place and provides a secure seal so that it does not fall off the object.
The ATS-18H-05-C2-R0 is specifically designed for cooling and regulating processors, computer systems, and other high-heat producing electronic components. Because of its unique design, it can provide excellent thermal performance and cooling effectiveness without being excessively large and bulky. Additionally, it is also well-suited for applications that require good thermal conductivity and/or where a large amount of heat needs to be efficiently dissipated.
The ATS-18H-05-C2-R0 utilizes a combination of a base plate and a number of fins to efficiently dissipate heat away from the object. The fins are connected to the base plate via a set of pillars which ensures that the baseplate and fins stay in contact with each other at all times. The heat is absorbed by the heat sink’s base plate at one end and then is transferred through the fins and dissipated into the surrounding area. As the heat is dissipated, the components and devices that make up the object will cool down.
The baseplate of the ATS-18H-05-C2-R0 is pre-pressed to obtain a tight bonding with the fins and ensure the highest performance level possible. This helps to ensure that the heat can be efficiently transferred from the fins to the surrounding area. Additionally, the thermal fins are conically shaped to provide maximum surface area for transferring heat from the object.
The ATS-18H-05-C2-R0 thermal-heat sink is ideally suited for applications that require high-performance cooling but don’t need a large and bulky heat sink. The design of the heat sink effectively dissipates heat away from the object, ensuring that the temperature is kept within an acceptable range. This makes the ATS-18H-05-C2-R0 an ideal choice for processors, computer systems, and other high-heat producing types of electronic components.
The specific data is subject to PDF, and the above content is for reference