| Allicdata Part #: | ATS-18H-110-C3-R1-ND |
| Manufacturer Part#: |
ATS-18H-110-C3-R1 |
| Price: | $ 5.26 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X40X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18H-110-C3-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.73067 |
| 30 +: | $ 4.46796 |
| 50 +: | $ 4.20512 |
| 100 +: | $ 3.94235 |
| 250 +: | $ 3.67953 |
| 500 +: | $ 3.41671 |
| 1000 +: | $ 3.35100 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important consideration in a wide range of applications, from electronics to industrial automation and beyond. Heat sinks are essential components in these applications, allowing heat to be quickly dispersed in a reliable manner to prevent overheating or damage to other components. The ATS-18H-110-C3-R1 heat sink is a reliable and efficient thermal management solution designed to meet the needs of a wide range of applications.
The ATS-18H-110-C3-R1 is a heat sink with a compact and low profile design, making it ideal for applications where space is at a premium. It is built with a high quality base and clip construction, making it resistant to harsh environments and ensuring safe and reliable operation. The heat sink also features larger clips and a reinforced base to provide added flexibility in mounting it in tight quarters. It offers excellent performance in areas where rapid thermal transfer is required, making it an ideal choice for applications like industrial automation, telecommunications, and other high speed processors.
The working principle of the ATS-18H-110-C3-R1 heat sink is based on thermodynamics. The heat sink is designed to provide direct contact between the hot surfaces of the processor, or other component, and the heat sink, which is then cooled by an air or liquid cooler. This direct contact allows for the rapid transfer of heat away from the processor or component, keeping temperatures lower and extending the life of the component. The heat sink also helps to evenly disperse the heat, ensuring uniform cooling across the entire surface.
The thermal management capabilities of the ATS-18H-110-C3-R1 make it a great choice for applications where reliable thermal performance is required. Its low profile design and flexible mounting options make it ideal for tight quarters and applications that require a heat sink with a small footprint. The reinforced base and larger clips help to provide added stability and ensure that the heat sink is securely mounted to prevent movement or damage. Additionally, the direct contact thermal transfer helps to keep temperatures low, allowing components to remain cooler and last longer.
The ATS-18H-110-C3-R1 is a versatile and reliable heat sink, perfect for many thermal management applications. Its compact size and low profile design make it ideal for tight situations, while its direct contact and reinforced base ensure reliable thermal transfer and secure mounting. Its ability to evenly disperse heat allows it to offer excellent thermal performance, making it a great choice for areas where rapid heat transfer is required.
The specific data is subject to PDF, and the above content is for reference