| Allicdata Part #: | ATS-18H-146-C3-R0-ND |
| Manufacturer Part#: |
ATS-18H-146-C3-R0 |
| Price: | $ 3.89 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18H-146-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.53934 |
| 30 +: | $ 3.34278 |
| 50 +: | $ 3.14622 |
| 100 +: | $ 2.94953 |
| 250 +: | $ 2.75290 |
| 500 +: | $ 2.55626 |
| 1000 +: | $ 2.50711 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management plays an important role in many devices and systems. Heat generated by components must be removed in order to maintain operation at peak performance. The ATS-18H-146-C3-R0 is a heat sink suitable for a wide variety of applications where thermal management is required. This article will discuss the application field and working principle of the ATS-18H-146-C3-R0.
The ATS-18H-146-C3-R0 is a thermally conductive and non-silicone-based thermoelectric heat sink. It is designed to dissipate large amounts of heat quickly and efficiently. It has a maximum temperature rating of 550 Celsius and a thermal resistance of 0.038 C/W. It is made from high-quality aluminum and is available in two variations: standard and low-profile. The standard version measures 113.8mm x 146.5mm x 47.8mm while the low-profile version measures 91.9mm x 106.2mm x 18.2mm. The thermal paste attached to the base of the heat sink helps ensure better heat transfer.
The ATS-18H-146-C3-R0 can be used in a variety of applications. It is commonly used to cool high-powered processors, drivers, and other electronic components that generate a lot of heat. It can also be used to dissipate thermal energy from power supplies, LED lighting, and other heat-generating devices. The small size and high thermal performance of the ATS-18H-146-C3-R0 make it ideal for applications where space is at a premium.
The ATS-18H-146-C3-R0 works by dissipating thermal energy away from the components that generate it. When a component generates heat, it is dissipated away from the component via a heat sink and the surrounding air. The heat is then dissipated away from the device by the air flowing over it. The more air that flows over a component, the more efficient the heat dissipation will be. The ATS-18H-146-C3-R0 provides an efficient way to cool components and can be used in many applications.
The ATS 18H-146-C3-R0 is a reliable thermally conductive and non-silicone-based thermoelectric heat sink. It is designed to dissipate large amounts of heat quickly and efficiently while operating at a maximum temperature rating of 550 Celsius with a thermal resistance of 0.038 C/W. It is a great solution for cooling high-powered processors, drivers, and other electronic components in applications where space is at a premium. The ATS 18H-146-C3-R0 can also be used to dissipate thermal energy from power supplies, LED lighting, and other heat-generating devices.
The specific data is subject to PDF, and the above content is for reference