| Allicdata Part #: | ATS-18H-170-C3-R0-ND |
| Manufacturer Part#: |
ATS-18H-170-C3-R0 |
| Price: | $ 3.66 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18H-170-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.32892 |
| 30 +: | $ 3.23862 |
| 50 +: | $ 3.05878 |
| 100 +: | $ 2.87885 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.60896 |
| 1000 +: | $ 2.33906 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical component for successful operation of electronic systems. Many modern electronics are designed to generate heat during normal operation, and as such require something called a heat sink to absorb and dissipate the thermal energy that is generated. The ATS-18H-170-C3-R0 Thermal - Heat Sink is a cost-effective solution for most applications.
The ATS-18H-170-C3-R0 Thermal - Heat Sink is an economical and efficient heat sink for many applications and uses. It is made out of high quality extruded aluminum and can handle temperatures up to 180 degrees Celsius (356 degrees Fahrenheit). Its long and narrow design allows it to fit into any form factor, making it extremely versatile. It is covered with a thermally conductive material, allowing it to quickly absorb the heat from electronic components and dissipate it into the surrounding environment.
The ATS-18H-170-C3-R0 is designed to work with a variety of components and is ideal for applications such as LED lighting, transistor and diode applications and picoprojectors. Additionally, it can be used in areas where cooling is critical, such as medical and communications systems, where the long life and consistent thermal distribution that the ATS-18H-170-C3-R0 provides can be invaluable.
One of the main advantages of the ATS-18H-170-C3-R0 is its working principle. Generally, all heat sinks work through thermal conduction, which is the transfer of heat from one material to another. The ATS-18H-170-C3-R0 works by transferring the heat from the electronic components to the heat sink through thermal conduction. Once the heat is transferred to the heat sink, it is then dissipated into the surrounding environment through the process of convection, which is the transfer of heat from one solid material to another by the movement of air or fluid. In this case, the air around the heat sink absorbs the heat from the heat sink and the heat is then dissipated into the surrounding environment.
The ATS-18H-170-C3-R0 Thermal - Heat Sink is a reliable and cost-effective thermal management solution for many applications. Its long and narrow design makes it suitable for many form factors and its thermally conductive coating allows it to quickly dissipate the heat from electronic components. Additionally, its working principle of thermal conduction and convection ensures that the heat is efficiently and effectively dissipated into the surrounding environment. The ATS-18H-170-C3-R0 Thermal - Heat Sink is a reliable and efficient solution for many applications.
The specific data is subject to PDF, and the above content is for reference