ATS-18H-20-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-18H-20-C3-R0-ND

Manufacturer Part#:

ATS-18H-20-C3-R0

Price: $ 4.67
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-18H-20-C3-R0 datasheetATS-18H-20-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.19895
30 +: $ 3.96543
50 +: $ 3.73225
100 +: $ 3.49896
250 +: $ 3.26570
500 +: $ 3.03243
1000 +: $ 2.97412
Stock 1000Can Ship Immediately
$ 4.67
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.21°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Heat Sinks

Heat sinks are devices found in a variety of electronic, automotive and other systems that are used to dissipate heat generated by components, whether they be in a CPU or a power transformer. In order to cool down these components, heat sinks are designed to absorb and distribute the heat and transfer it to the environment, either through an air or water-cooled mechanism, or a combination of both.

ATS-18H-20-C3-R0 Application Field

The ATS-18H-20-C3-R0 is a heat sink designed by ATS Cooling Systems, Inc. This particular model is one of their larger models and offers a fully integrated cooling solution for higher power applications. It features a large thermal spread area, an optional integrated fan (ATS-18H-S6-F4) to further increase the cooling performance, and an easy installation process. This particular model is commonly found in high-performance CPUs, power transformers, and certain HVAC systems.

ATS-18H-20-C3-R0 Working Principle

The ATS-18H-20-C3-R0 is a passive cooling system, meaning that it does not require any active power to operate. It works by transferring heat away from the component or device and into the heat sink, where it is then spread out over a larger surface area and dissipated into the air or water. This is done using conduction and convection, which involve the transfer of heat via thermal energy.

During conduction, heat from the component or device is transferred to the heat sink by way of thermal connections. As the thermal energy flows through the heat sink, it is spread out over a larger surface area, allowing more of the heat to dissipate into the air or water. The heat that is transferred to the air or water is then lost in one of three ways; conduction, convection, or radiation.

During convection, the heat is transferred to the cooler air around the heat sink via a fan or natural airflow. This airflow carries the heat away from the heat sink, allowing it to dissipate. During radiation, the heat is transferred directly from the heat sink to the environment, such as the atmosphere or water.

Finally, the ATS-18H-20-C3-R0 is also designed with an antifreeze system, which helps to prevent the unit from freezing in colder climates. This system utilizes a special antifreeze fluid to prevent any ice from forming on the heat sink itself.

Overall, the ATS-18H-20-C3-R0 is a reliable and effective heat sink suitable for a variety of applications. Its large thermal spread area, optional fan, and antifreeze system allows it to manage a wide range of temperatures and ensure optimal cooling performance. It is an excellent choice for anyone in need of a reliable cooling solution for their high-end components or devices.

The specific data is subject to PDF, and the above content is for reference

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